Inventor · disambiguated record
Hsiang-Tai Lu
Also filed as: LU HSIANG-TAI
31 granted patents·21 pending applications·202 citations·filing 2003–2025
96Inventor score
Top patents by PatentIndex Score
52 records- 0198US10741537B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 11, 2020·36 cites·20 claims
- 0297US10269586B2Package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·43 cites·20 claims
- 0396US8970023B2Package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 3, 2015·30 cites·20 claims
- 0493US9209048B2Two step molding grinding for packaging applicationsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 8, 2015·19 cites·20 claims
- 0591US11335672B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·2 cites·20 claims
- 0691US7462906B2Flash memory process with high voltage LDMOS embeddedTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Dec 9, 2008·21 cites·8 claims
- 0789US10347574B2Integrated fan-out packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 9, 2019·5 cites·20 claims
- 0886US12253558B2Circuit test structure and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 0985US12322742B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 1085US2025266417A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1184US8618640B2Method of shielding through silicon vias in a passive interposerLU HSIANG-TAI·Filed 2011·Granted Dec 31, 2013·8 cites·20 claims
- 1283US8664540B2Interposer testing using dummy connectionsLU HSIANG-TAI·Filed 2011·Granted Mar 4, 2014·8 cites·5 claims
- 1379US11855066B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1479US11002788B2Circuit test structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·1 cites·20 claims
- 1579US10879162B2Integrated fan-out packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·2 cites·15 claims
- 1679US2025364373A1Semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1779US2025164548A1Method of using circuit test structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1879US2025357320A1Delamination detection structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1977US12125810B2Delamination sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 2077US2024387411A1Delamination sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2176US10288676B2Circuit test structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·1 cites·20 claims
- 2275US11828790B2Circuit test structure and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·20 claims
- 2374US9941239B2Electrostatic discharge protection apparatus and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·2 cites·20 claims
- 2474US7282410B2Flash memory process with high voltage LDMOS embeddedTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 16, 2007·17 cites·27 claims
- 2572US2025140684A1Delamination detection structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2669US11616029B2Delamination sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 28, 2023·0 cites·20 claims
- 2768US12469768B2Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 11, 2025·0 cites·20 claims
- 2867US9491840B2Electrostatic discharge protection apparatus and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 8, 2016·2 cites·19 claims
- 2963US9040986B2Three dimensional integrated circuit having a resistance measurement structure and method of useCHEN CHING-FANG·Filed 2012·Granted May 26, 2015·1 cites·20 claims
- 3062US12512372B2Semiconductor structure with testing pads and method of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 3160US2025233026A1Semiconductor device and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3260US2025239495A1Semiconductor die and wafer bonding crack detector structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3360US2025266336A1Semiconductor package and method of manufacturing and testing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3459US2025253225A1Redistribution layer having guard members and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3558US2025226269A1Test pad structure and method of manufacturing and operating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3656US9689914B2Method of testing a three-dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 27, 2017·0 cites·20 claims
- 3755US2025015034A1Semiconductor structure with daisy chain and a method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3855US2024047384A1Method of manufacturing a semiconductor device and a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3955US2025046702A1Semiconductor structure including crack detector and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4055US2024274541A1Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4154US2025054934A1Forming a cavity in a redistribution layer of an ic package to reduce overspreading of underfill materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4253US2024363576A1Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4352US2024243163A1Inductor structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4451US9159564B2Method of shielding through silicon vias in a passive interposerTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 13, 2015·0 cites·20 claims
- 4549US9607999B2System and method of UV programming of non-volatile semiconductor memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Mar 28, 2017·0 cites·20 claims
- 4649US9190148B2System and method of UV programming of non-volatile semiconductor memoryLU HSIANG-TAI·Filed 2012·Granted Nov 17, 2015·0 cites·14 claims
- 4749US6958939B2Flash memory cell having multi-program channelsTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 25, 2005·4 cites·19 claims
- 4839US2007155092A1Method for forming a tipTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 4937US2008024164A1Reconfigurable programmable logic device with P-channel non-volatile memory cellsTAIWAN SEMICONDUCTOR MFG·Filed 2006·Application pending·0 cites
- 5036US7348832B2Dual-voltage generation systemTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 25, 2008·0 cites·18 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →