Inventor · disambiguated record
Hsiang-Hua Lu
Also filed as: LU HSIANG-HUA
5 granted patents·6 pending applications·0 citations·filing 2019–2022
59Inventor score
Top patents by PatentIndex Score
11 records- 0158US2022344277A1Fan-out packaging structureKORE SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 0256US11462481B2Fan-out packaging structure and method of making sameKORE SEMICONDUCTOR CO LTD·Filed 2020·Granted Oct 4, 2022·0 cites·5 claims
- 0351US12176615B2Electronic device and manufacturing method thereofKORE SEMICONDUCTOR CO LTD·Filed 2022·Granted Dec 24, 2024·0 cites·20 claims
- 0448US12174170B2Biochip packaging structureKORE SEMICONDUCTOR CO LTD·Filed 2020·Granted Dec 24, 2024·0 cites·6 claims
- 0548US11056411B2Chip packaging structureHON HAI PREC IND CO LTD·Filed 2019·Granted Jul 6, 2021·0 cites·5 claims
- 0648US2022032292A1Biochip structure and method for making sameSOCLE TECH CORP·Filed 2020·Application pending·0 cites
- 0742US11581260B2Package structure and manufacturing method thereofKORE SEMICONDUCTOR CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·4 claims
- 0842US2022122951A1Packaging structure and method for manufacturing packaging structureSOCLE TECH CORP·Filed 2020·Application pending·0 cites
- 0942US2021151395A1Package structure with integrated antenna, package structure array, and manufacturing method thereofSOCLE TECH CORP·Filed 2020·Application pending·0 cites
- 1039US2021313244A1Fingerprint identification chip package and method for making sameSOCLE TECH CORP·Filed 2020·Application pending·0 cites
- 1134US2020343285A1Packaging structure for image sensor, lens module, and electronic device using the sameHON HAI PREC IND CO LTD·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →