Fan-out packaging structure

Abstract

A fan-out packaging structure includes a redistribution layer and a positioning sheet formed on the redistribution layer. The positioning sheet defines at least one opening penetrating opposite sides of the positioning sheet. At least one chip is mounted in the at least one opening. The redistribution layer comprises at least one conductive circuit. The at least one chip is electrically coupled to a corresponding one conductive circuit.

What is claimed is: 
     
         1 . A fan-out packaging structure comprising:
 a redistribution layer comprising at least one conductive circuit;   at least one chip mounted on the redistribution layer through at least one opening defined by a positioning sheet forming on the redistribution layer and electrically coupled to a corresponding one of the at least one conductive circuit; and   a protective layer covering on surfaces of the at least one chip and on side surfaces of the redistribution layer after the at least one chip is mounted and the positioning sheet is removed.   
     
     
         2 . The fan-out packaging structure of  claim 1 , wherein:
 each of the conductive circuits comprises at least one first connection pad located on a surface of the redistribution layer facing the positioning sheet;   the at least one first connection pad is exposed on the surface of the redistribution layer facing the positioning sheet;   the at least one opening is defined at a position of the at least one first connection pad; and   the at least one chip is electrically coupled to the at least one first connection pad.   
     
     
         3 . The fan-out packaging structure of  claim 2 , wherein:
 each of the conductive circuits comprises at least one second connection pad located on a surface of the redistribution layer facing away from the positioning sheet; and   the at least one first connection pad is electrically coupled to the at least one second connection pad.   
     
     
         4 . The fan-out packaging structure of  claim 3 , wherein:
 a diameter of the opening increases from a surface of the positioning sheet facing the redistribution layer to a surface of the positioning sheet facing away from the redistribution layer;   the diameter of the opening at the surface of the positioning sheet facing the redistribution layer is equal to a width of the first connection pad;   a gap is defined between the at least one chip and an inner wall of the opening; and the protective layer is filled in the gap.   
     
     
         5 . The fan-out packaging structure of  claim 1 , wherein:
 the redistribution layer is adhered to the carrier board by a peelable film.