Inventor · disambiguated record
Ching-Yu Ni
Also filed as: NI CHING-YU
22 granted patents·8 pending applications·70 citations·filing 2005–2022
93Inventor score
Files withXINTEC INC6KORE SEMICONDUCTOR CO LTD5SOCLE TECH CORP4TAIWAN SEMICONDUCTOR MFG4TSAI CHIA-LUN4
Top patents by PatentIndex Score
30 records- 0193US8367477B2Electronic device package and method for forming the sameCHIEN WEN-CHENG·Filed 2010·Granted Feb 5, 2013·16 cites·8 claims
- 0289US8552547B2Electronic device package and method for forming the sameXINTEC INC·Filed 2013·Granted Oct 8, 2013·7 cites·7 claims
- 0386US8541877B2Electronic device package and method for fabricating the sameTSAI CHIA-LUN·Filed 2010·Granted Sep 24, 2013·9 cites·26 claims
- 0485US7135769B2Semiconductor packages and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 14, 2006·12 cites·9 claims
- 0581US8716109B2Chip package and fabrication method thereofXINTEC INC·Filed 2013·Granted May 6, 2014·4 cites·14 claims
- 0676US7271480B2Constraint stiffener designTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 18, 2007·7 cites·22 claims
- 0774US8384222B2Semiconductor device and manufacturing method thereofTSAI CHIA-LUN·Filed 2011·Granted Feb 26, 2013·3 cites·19 claims
- 0873US8431950B2Light emitting device package structure and fabricating method thereofTSAI CHIA-LUN·Filed 2009·Granted Apr 30, 2013·5 cites·10 claims
- 0971US7348218B2Semiconductor packages and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Mar 25, 2008·4 cites·20 claims
- 1063US8410599B2Power MOSFET packagePERNG BAW-CHING·Filed 2010·Granted Apr 2, 2013·2 cites·10 claims
- 1159US9799588B2Chip package and manufacturing method thereofXINTEC INC·Filed 2014·Granted Oct 24, 2017·0 cites·13 claims
- 1259US7968448B2Semiconductor device and manufacturing method thereofTSAI CHIA-LUN·Filed 2009·Granted Jun 28, 2011·1 cites·2 claims
- 1358US2022344277A1Fan-out packaging structureKORE SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 1457US8822325B2Chip package and fabrication method thereofXINTEC INC·Filed 2013·Granted Sep 2, 2014·0 cites·11 claims
- 1556US11462481B2Fan-out packaging structure and method of making sameKORE SEMICONDUCTOR CO LTD·Filed 2020·Granted Oct 4, 2022·0 cites·5 claims
- 1656US8643198B2Electronic device package and method for forming the sameXINTEC INC·Filed 2013·Granted Feb 4, 2014·0 cites·19 claims
- 1749US8766431B2Power MOSFET packageXINTEC INC·Filed 2013·Granted Jul 1, 2014·0 cites·10 claims
- 1848US12174170B2Biochip packaging structureKORE SEMICONDUCTOR CO LTD·Filed 2020·Granted Dec 24, 2024·0 cites·6 claims
- 1948US11056411B2Chip packaging structureHON HAI PREC IND CO LTD·Filed 2019·Granted Jul 6, 2021·0 cites·5 claims
- 2048US2022032292A1Biochip structure and method for making sameSOCLE TECH CORP·Filed 2020·Application pending·0 cites
- 2145US11569195B2Semiconductor packaging structure and method of fabricating sameKORE SEMICONDUCTOR CO LTD·Filed 2019·Granted Jan 31, 2023·0 cites·7 claims
- 2244US8564123B2Chip package and fabrication method thereofNI CHING-YU·Filed 2011·Granted Oct 22, 2013·0 cites·15 claims
- 2343US2011127681A1Chip package and fabrication method thereofNI CHING-YU·Filed 2010·Application pending·0 cites
- 2442US11581260B2Package structure and manufacturing method thereofKORE SEMICONDUCTOR CO LTD·Filed 2020·Granted Feb 14, 2023·0 cites·4 claims
- 2542US2022122951A1Packaging structure and method for manufacturing packaging structureSOCLE TECH CORP·Filed 2020·Application pending·0 cites
- 2642US2021151395A1Package structure with integrated antenna, package structure array, and manufacturing method thereofSOCLE TECH CORP·Filed 2020·Application pending·0 cites
- 2740US2006261469A1Sealing membrane for thermal interface materialTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 2839US2021313244A1Fingerprint identification chip package and method for making sameSOCLE TECH CORP·Filed 2020·Application pending·0 cites
- 2934US2020343285A1Packaging structure for image sensor, lens module, and electronic device using the sameHON HAI PREC IND CO LTD·Filed 2020·Application pending·0 cites
- 3033US8766400B2Electronic device containing passive components and fabrication method thereofNI CHING-YU·Filed 2010·Granted Jul 1, 2014·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →