Inventor · disambiguated record
Hsien-Liang Meng
Also filed as: MENG HSIEN-LIANG
18 granted patents·6 pending applications·98 citations·filing 1996–2019
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD7UNITED MICROELECTRONICS CORP5UNITED SILICON INC3MOSEL VITELIC INC2SHIH HUNG-LIN2
Top patents by PatentIndex Score
24 records- 0192US10049894B2Package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·7 cites·20 claims
- 0290US7402496B2Complementary metal-oxide-semiconductor device and fabricating method thereofUNITED MICROELECTRONICS CORP·Filed 2006·Granted Jul 22, 2008·29 cites·23 claims
- 0386US10269669B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·7 cites·20 claims
- 0482US7288828B2Metal oxide semiconductor transistor deviceUNITED MICROELECTRONICS CORP·Filed 2005·Granted Oct 30, 2007·11 cites·19 claims
- 0576US9127356B2Sputtering target with reverse erosion profile surface and sputtering system and method using the sameCHUEH CHIA-LIANG·Filed 2011·Granted Sep 8, 2015·2 cites·18 claims
- 0674US11088109B2Packages with multi-thermal interface materials and methods of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·2 cites·20 claims
- 0761US9129878B2Mechanisms for forming backside illuminated image sensor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 8, 2015·0 cites·16 claims
- 0858US11211261B2Package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 28, 2021·0 cites·20 claims
- 0955US9362236B2Package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 7, 2016·0 cites·22 claims
- 1054US9064880B2Zero stand-off bonding system and methodTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 23, 2015·0 cites·20 claims
- 1153US10872831B2Method of forming a semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·20 claims
- 1250US9418956B2Zero stand-off bonding system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 16, 2016·0 cites·20 claims
- 1347US2008164529A1Semiconductor device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2007·Application pending·0 cites
- 1446US5770515AMethod of in-situ wafer cooling for a sequential WSI/alpha -Si sputtering processMOSEL VITELIC INC·Filed 1996·Granted Jun 23, 1998·18 cites·2 claims
- 1546US2008194070A1Metal-oxide-semiconductor transistor device, manufacturing method thereof, and method of improving drain current thereofSHIH HUNG-LIN·Filed 2008·Application pending·0 cites
- 1644US2011294287A1Method of manufacturing semiconductor device having dual fully-silicided gateLIN CHIN-HSIANG·Filed 2011·Application pending·0 cites
- 1743US2008017931A1Metal-oxide-semiconductor transistor device, manufacturing method thereof, and method of improving drain current thereofSHIH HUNG-LIN·Filed 2006·Application pending·0 cites
- 1839US2008116525A1Complementary metal-oxide-semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2008·Application pending·0 cites
- 1936US5963830AMethod of forming a TiN/W barrier layer for a hot Al plugMOSEL VITELIC INC·Filed 1997·Granted Oct 5, 1999·8 cites·5 claims
- 2032US6225189B1Method of fabricating shallow trench isolation structureUNITED MICROELECTRONICS CORP·Filed 1999·Granted May 1, 2001·3 cites·14 claims
- 2132US6204147B1Method of manufacturing shallow trench isolationUNITED SILICON INC·Filed 1999·Granted Mar 20, 2001·4 cites·14 claims
- 2232US6124204AMethod of removing copper oxide within via holeUNITED SILICON INC·Filed 1998·Granted Sep 26, 2000·5 cites·4 claims
- 2330US6187692B1Method for forming an insulating filmUNITED SILICON INC·Filed 1998·Granted Feb 13, 2001·2 cites·20 claims
- 2427US2001051424A1Method of forming an opening in a dielectric layer in integrated circuitFiled 1999·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →