Inventor · disambiguated record
Hsin-Yu Pan
Also filed as: PAN HSIN-YU
74 granted patents·22 pending applications·289 citations·filing 2004–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD79TAIWAN SEMICONDUCTOR MFG10AU OPTRONICS CORP2LIU YU-CHIH1LIU YU-WEN1
Top patents by PatentIndex Score
96 records- 0198US11942442B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 26, 2024·4 cites·20 claims
- 0298US11296067B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 5, 2022·4 cites·20 claims
- 0397US12266648B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 1, 2025·2 cites·20 claims
- 0497US11824054B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 21, 2023·2 cites·20 claims
- 0597US11450581B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 20, 2022·11 cites·20 claims
- 0697US10490479B1Packaging of semiconductor device with antenna and heat spreaderTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 26, 2019·16 cites·20 claims
- 0796US11749640B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·2 cites·20 claims
- 0896US11444023B2Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·4 cites·20 claims
- 0996US10510713B1Semicondcutor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·12 cites·20 claims
- 1096US10163754B2Lid design for heat dissipation enhancement of die packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Dec 25, 2018·31 cites·20 claims
- 1195US12021024B2Semiconductor device including a semiconductor die and a plurality of antenna patternsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·2 cites·20 claims
- 1294US11984372B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 14, 2024·2 cites·20 claims
- 1394US9543373B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 10, 2017·15 cites·20 claims
- 1493US11574857B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 7, 2023·3 cites·20 claims
- 1593US10840197B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 17, 2020·6 cites·20 claims
- 1693US10818588B2Semiconductor device, package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 27, 2020·7 cites·20 claims
- 1793US10818651B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 27, 2020·6 cites·20 claims
- 1892US11894341B2Semiconductor package with through vias and stacked redistribution layers and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·2 cites·20 claims
- 1992US11705408B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 18, 2023·2 cites·20 claims
- 2092US11532576B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 20, 2022·3 cites·20 claims
- 2192US11205636B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 21, 2021·2 cites·20 claims
- 2292US9502383B23D integrated circuit package processing with panel type lidTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 22, 2016·10 cites·17 claims
- 2391US7514775B2Stacked structures and methods of fabricating stacked structuresTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Apr 7, 2009·24 cites·21 claims
- 2491US2025343136A1Conductive Traces in Semiconductor Devices and Methods of Forming SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2590US11705378B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 18, 2023·2 cites·20 claims
- 2689US2025343178A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2788US11145639B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 12, 2021·5 cites·20 claims
- 2888US7583502B2Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC)TAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Sep 1, 2009·17 cites·17 claims
- 2987US10020236B2Dam for three-dimensional integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jul 10, 2018·6 cites·20 claims
- 3087US2024387498A1Manufacturing method of semiconductor package with thermal relaxation blockTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3186US12451426B2Conductive traces in semiconductor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 21, 2025·0 cites·19 claims
- 3286US9780046B2Seal rings structures in semiconductor device interconnect layers and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 3, 2017·5 cites·20 claims
- 3385US12424571B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 23, 2025·0 cites·20 claims
- 3485US12362275B2Method of fabricating package structure including a plurality of antenna patternsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 3585US10872842B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 22, 2020·4 cites·20 claims
- 3685US10811384B2Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 20, 2020·2 cites·20 claims
- 3785US7135769B2Semiconductor packages and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 14, 2006·12 cites·9 claims
- 3884US12255196B2Semiconductor package with thermal relaxation block and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 3982US10157900B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 18, 2018·3 cites·20 claims
- 4081US12362321B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 15, 2025·0 cites·20 claims
- 4181US2025309193A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4280US10748831B2Semiconductor packages having thermal through vias (TTV)TAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 18, 2020·2 cites·20 claims
- 4380US9653406B2Conductive traces in semiconductor devices and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 16, 2017·2 cites·19 claims
- 4480US8810025B2Reinforcement structure for flip-chip packagingLIU YU-WEN·Filed 2011·Granted Aug 19, 2014·6 cites·17 claims
- 4580US7361986B2Heat stud for stacked chip packageTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 22, 2008·28 cites·14 claims
- 4680US2025183245A1Semiconductor package with thermal relaxation block and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4779US12230589B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 4879US2025357443A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4978US11830866B2Semiconductor package with thermal relaxation block and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 5077US2024304561A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 96 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →