Inventor · disambiguated record
Hsing-Lung Shen
Also filed as: SHEN HSING-LUNG
8 granted patents·3 pending applications·3 citations·filing 2015–2023
74Inventor score
Files withXINTEC INC11
Top patents by PatentIndex Score
11 records- 0179US12473197B2Chip packageXINTEC INC·Filed 2023·Granted Nov 18, 2025·0 cites·19 claims
- 0277US11137559B2Optical chip package and method for forming the sameXINTEC INC·Filed 2020·Granted Oct 5, 2021·1 cites·29 claims
- 0370US9972584B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted May 15, 2018·2 cites·16 claims
- 0465US11873212B2Chip package and manufacturing method thereofXINTEC INC·Filed 2021·Granted Jan 16, 2024·0 cites·9 claims
- 0552US11107759B2Chip package and manufacturing method thereofXINTEC INC·Filed 2020·Granted Aug 31, 2021·0 cites·17 claims
- 0646US2021210538A1Chip package and method for forming the sameXINTEC INC·Filed 2020·Application pending·0 cites
- 0743US10049252B2Chip package and fabrication method thereofXINTEC INC·Filed 2015·Granted Aug 14, 2018·0 cites·20 claims
- 0835US9793234B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Oct 17, 2017·0 cites·18 claims
- 0935US9548265B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Jan 17, 2017·0 cites·26 claims
- 1034US2017207194A1Chip package and method for forming the sameXINTEC INC·Filed 2017·Application pending·0 cites
- 1134US2016240520A1Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →