Inventor · disambiguated record
Hsin-Chang Tsai
Also filed as: TSAI HSIN-CHANG
32 granted patents·18 pending applications·226 citations·filing 2004–2024
95Inventor score
Files withDELTA ELECTRONICS INC27ACTRON TECH CORP12EVERLIGHT ELECTRONICS CO LTD4VANGUARD INT SEMICONDUCT CORP2CHIANG JEN-TA1
Top patents by PatentIndex Score
50 records- 0196US11177188B1Heat dissipation substrate for multi-chip packageACTRON TECH CORP·Filed 2020·Granted Nov 16, 2021·4 cites·12 claims
- 0292US11133246B1Semiconductor structure employing conductive paste on lead frameVANGUARD INT SEMICONDUCT CORP·Filed 2020·Granted Sep 28, 2021·3 cites·20 claims
- 0391USD584428SLED lampEVERLIGHT ELECTRONICS CO LTD·Filed 2008·Granted Jan 6, 2009·140 cites·1 claims
- 0490US9177957B1Embedded packaging deviceDELTA ELECTRONICS INC·Filed 2014·Granted Nov 3, 2015·13 cites·19 claims
- 0586US9385070B2Semiconductor component having a lateral semiconductor device and a vertical semiconductor deviceDELTA ELECTRONICS INC·Filed 2013·Granted Jul 5, 2016·9 cites·20 claims
- 0677US11183439B2Package structure for power deviceACTRON TECH CORP·Filed 2019·Granted Nov 23, 2021·2 cites·11 claims
- 0777US9431327B2Semiconductor deviceDELTA ELECTRONICS INC·Filed 2014·Granted Aug 30, 2016·4 cites·19 claims
- 0876US8405105B2Light emitting deviceCHIANG JEN-TA·Filed 2010·Granted Mar 26, 2013·5 cites·20 claims
- 0974USD646015SLight emitting diode lampEVERLIGHT ELECTRONICS CO LTD·Filed 2010·Granted Sep 27, 2011·21 cites·1 claims
- 1072US9159699B2Interconnection structure having a via structureDELTA ELECTRONICS INC·Filed 2012·Granted Oct 13, 2015·3 cites·18 claims
- 1168US8912663B1Embedded package structure and method for manufacturing thereofDELTA ELECTRONICS INC·Filed 2013·Granted Dec 16, 2014·2 cites·20 claims
- 1264US8378358B2Light emitting deviceEVERLIGHT ELECTRONICS CO LTD·Filed 2010·Granted Feb 19, 2013·1 cites·26 claims
- 1364US7013537B2Detent means for a heat sinkGLACIALTECH INC·Filed 2004·Granted Mar 21, 2006·15 cites·8 claims
- 1463US12408281B2Circuit substrate and electronic deviceACTRON TECH CORP·Filed 2023·Granted Sep 2, 2025·0 cites·10 claims
- 1563US10685904B2Packaging device and manufacturing method thereofDELTA ELECTRONICS INC·Filed 2014·Granted Jun 16, 2020·1 cites·12 claims
- 1662US11049796B2Manufacturing method of packaging deviceDELTA ELECTRONICS INC·Filed 2020·Granted Jun 29, 2021·0 cites·7 claims
- 1762US9209164B2Interconnection structure of package structure and method of forming the sameDELTA ELECTRONICS INC·Filed 2013·Granted Dec 8, 2015·1 cites·10 claims
- 1862US2025246446A1Semiconductor module and manufacturing method thereofACTRON TECH CORP·Filed 2024·Application pending·0 cites
- 1961US7528472B2Chip package mechanismDELTA ELECTRONICS INC·Filed 2005·Granted May 5, 2009·2 cites·27 claims
- 2060US9905439B2Power module package having patterned insulation metal substrateDELTA ELECTRONICS INC·Filed 2016·Granted Feb 27, 2018·0 cites·2 claims
- 2159US2025096086A1Semiconductor module and manufacturing method thereofACTRON TECH CORP·Filed 2023·Application pending·0 cites
- 2256US2024274515A1Power semiconductor package signal connection component and semiconductor moduleACTRON TECH CORP·Filed 2023·Application pending·0 cites
- 2356US2024282652A1Energy conversion module and energy conversion deviceACTRON TECH CORP·Filed 2023·Application pending·0 cites
- 2452US11810835B2Intelligent power module packaging structureACTRON TECH CORP·Filed 2020·Granted Nov 7, 2023·0 cites·13 claims
- 2552US2024178285A1High electron mobility transistor and fabrication method thereofVANGUARD INT SEMICONDUCT CORP·Filed 2023·Application pending·0 cites
- 2649US10424508B2Interconnection structure having a via structure and fabrication thereofDELTA ELECTRONICS INC·Filed 2015·Granted Sep 24, 2019·0 cites·12 claims
- 2749US9275982B2Method of forming interconnection structure of package structureDELTA ELECTRONICS INC·Filed 2015·Granted Mar 1, 2016·0 cites·10 claims
- 2847US10804189B2Power device package structureACTRON TECH CORP·Filed 2018·Granted Oct 13, 2020·0 cites·15 claims
- 2947US9184111B2Wafer-level chip scale packageDELTA ELECTRONICS INC·Filed 2014·Granted Nov 10, 2015·0 cites·18 claims
- 3046US11232992B2Power device package structureACTRON TECH CORP·Filed 2018·Granted Jan 25, 2022·0 cites·9 claims
- 3146US9865531B2Power module package having patterned insulation metal substrateDELTA ELECTRONICS INC·Filed 2016·Granted Jan 9, 2018·0 cites·14 claims
- 3246US2007057348A1Microstructure and manufacturing method thereofDELTA ELECTRONICS INC·Filed 2006·Application pending·0 cites
- 3344US10741644B2Semiconductor devices with via structure and package structures comprising the sameDELTA ELECTRONICS INC·Filed 2016·Granted Aug 11, 2020·0 cites·26 claims
- 3444US9748165B2Packaging structureDELTA ELECTRONICS INC·Filed 2016·Granted Aug 29, 2017·0 cites·20 claims
- 3544US2009011343A1Microstructure and manufacturing method thereofTSAI HSIN-CHANG·Filed 2008·Application pending·0 cites
- 3644US2021050320A1Package structure for power deviceACTRON TECH CORP·Filed 2019·Application pending·0 cites
- 3743US2006039818A1Method of forming a dieDELTA ELECTRONICS INC·Filed 2005·Application pending·0 cites
- 3843US2017218512A1Method of Fabricating High-Conductivity Thick-film Copper Paste Coated with Nano-Silver for Being Sintered in the AirUNIV NAT CHENG KUNG·Filed 2016·Application pending·0 cites
- 3941US10056319B2Power module package having patterned insulation metal substrateDELTA ELECTRONICS INC·Filed 2017·Granted Aug 21, 2018·0 cites·17 claims
- 4041US2008218051A1Socket LED deviceEVERLIGHT ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 4140US2007117247A1Manufacturing method of microstructureDELTA ELECTRONICS INC·Filed 2006·Application pending·0 cites
- 4240US2006144565A1Heat dissipation devices and fabrication methods thereofDELTA ELECTRONICS INC·Filed 2005·Application pending·0 cites
- 4340US2019393136A1Power device for rectifierACTRON TECH CORP·Filed 2018·Application pending·0 cites
- 4440US2006119457A1Micro-switchDELTA ELECTRONICS INC·Filed 2005·Application pending·0 cites
- 4540US2006213648A1Method for manufacturing heat dissipation apparatusDELTA ELECTRONICS INC·Filed 2005·Application pending·0 cites
- 4639US2006081360A1Heat dissipation apparatus and manufacturing method thereofDELTA ELECTRONICS INC·Filed 2005·Application pending·0 cites
- 4738US10892210B2Package structuresDELTA ELECTRONICS INC·Filed 2016·Granted Jan 12, 2021·0 cites·16 claims
- 4838US8067781B2Light emitting structure and securing device thereofLIANG CHIA-HAO·Filed 2008·Granted Nov 29, 2011·0 cites·20 claims
- 4935US9847312B2Package structureDELTA ELECTRONICS INC·Filed 2016·Granted Dec 19, 2017·0 cites·14 claims
- 5031US2016260660A1Electronic device and electronic package thereofDELTA ELECTRONICS INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →