Inventor · disambiguated record
Hsing-Hua Tsai
Also filed as: TSAI HSING-HUA
10 granted patents·10 pending applications·14 citations·filing 2012–2024
81Inventor score
Files withAG MATERIALS TECH CO LTD7WIRE TECH CO LTD4LEE JUN-DER3SUREWAY TECH CO LTD2CHUANG CHIEN HSUN1
Top patents by PatentIndex Score
20 records- 0190US11837568B2Bonding structures and methods for forming the sameAG MATERIALS TECH CO LTD·Filed 2021·Granted Dec 5, 2023·2 cites·10 claims
- 0281US11488920B2Silver nano-twinned thin film structure and method for forming the sameAG MATERIALS TECH CO LTD·Filed 2020·Granted Nov 1, 2022·3 cites·15 claims
- 0380US8940403B2Alloy wire and methods for manufacturing the sameLEE JUN-DER·Filed 2012·Granted Jan 27, 2015·7 cites·19 claims
- 0461US9425168B2Stud bump and package structure thereof and method of manufacturing the sameWIRE TECH CO LTD·Filed 2014·Granted Aug 23, 2016·2 cites·11 claims
- 0558US12148725B2Bonding structures and methods for forming the sameAG MATERIALS TECH CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 0657US12191274B2Nano-twinned structure on metallic thin film surface and method for forming the sameAG MATERIALS TECH CO LTD·Filed 2022·Granted Jan 7, 2025·0 cites·5 claims
- 0757US2022388092A1Methods for forming bonding structuresUNIV NAT TAIWAN·Filed 2022·Application pending·0 cites
- 0855US2023057312A1Metallic nano-twinned thin film structure and method for forming the sameAG MATERIALS TECH CO LTD·Filed 2021·Application pending·0 cites
- 0953US2025385211A1Package structure and packaging methodSUREWAY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1053US2025385155A1Package structure and method of forming the sameSUREWAY TECH CO LTD·Filed 2024·Application pending·0 cites
- 1152US2025140733A1Die bonding structure and method of manufacturing the sameAG MATERIALS TECH CO LTD·Filed 2024·Application pending·0 cites
- 1247US2022336407A1Die bonding structures and method for forming the sameAG MATERIALS TECH CO LTD·Filed 2021·Application pending·0 cites
- 1345US9901865B2Structure of assembly grasp for palladium-alloy tubes and method for manufacturing the sameCHUANG CHIEN HSUN·Filed 2016·Granted Feb 27, 2018·0 cites·21 claims
- 1443US9724000B2Exercise guiding system, exercise guiding method and anaerobic threshold measuring methodIND TECH RES INST·Filed 2014·Granted Aug 8, 2017·0 cites·23 claims
- 1542US9490147B2Stud bump structure and method for manufacturing the sameWIRE TECH CO LTD·Filed 2013·Granted Nov 8, 2016·0 cites·13 claims
- 1638US2013233594A1Composite wire of silver-gold-palladium alloy coated with metal thin film and method thereofLEE JUN DER·Filed 2013·Application pending·0 cites
- 1738US2013233593A1Composite wire of silver-palladium alloy coated with metallic thin film and method thereofLEE JUN-DER·Filed 2013·Application pending·0 cites
- 1834US9997488B2Copper-based alloy wire and methods for manufaturing the sameCHUANG TUNG HAN·Filed 2014·Granted Jun 12, 2018·0 cites·16 claims
- 1920US2017103823A1Graphene coated silver alloy wire and methods for manufacturing the sameWIRE TECH CO LTD·Filed 2016·Application pending·0 cites
- 2020US2018076167A1Metallic ribbon for power module packagingWIRE TECH CO LTD·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →