Inventor · disambiguated record
Hsiu-Wen Tu
Also filed as: TU HSIU W · TU HSIU-WEN
35 granted patents·18 pending applications·480 citations·filing 2000–2019
97Inventor score
Top patents by PatentIndex Score
53 records- 0192US8481343B2Manufacturing method of molded image sensor packaging structure with predetermined focal length and the structure using the sameHSIN CHUNG-HSIEN·Filed 2010·Granted Jul 9, 2013·20 cites·7 claims
- 0291US7554599B2Image sensor module with air escape hole and a method for manufacturing the sameKINGPAK TECH INC·Filed 2006·Granted Jun 30, 2009·17 cites·9 claims
- 0390US8969120B2Two-stage packaging method of image sensorsKINGPAK TECH INC·Filed 2013·Granted Mar 3, 2015·15 cites·11 claims
- 0489US8440488B2Manufacturing method and structure for wafer level image sensor module with fixed focal lengthTU HSIU-WEN·Filed 2010·Granted May 14, 2013·8 cites·4 claims
- 0589US7423334B2Image sensor module with a protection layer and a method for manufacturing the sameKINGPAK TECH INC·Filed 2005·Granted Sep 9, 2008·20 cites·2 claims
- 0687US6521881B2Stacked structure of an image sensor and method for manufacturing the sameKINGPAK TECH INC·Filed 2001·Granted Feb 18, 2003·53 cites·15 claims
- 0786US10340250B2Stack type sensor package structureKINGPAK TECH INC·Filed 2018·Granted Jul 2, 2019·6 cites·22 claims
- 0886US6696738B1Miniaturized image sensorKINGPAK TECH INC·Filed 2002·Granted Feb 24, 2004·44 cites·12 claims
- 0986US6559539B2Stacked package structure of image sensorFiled 2001·Granted May 6, 2003·55 cites·10 claims
- 1085US10692917B2Sensor package structureKINGPAK TECH INC·Filed 2018·Granted Jun 23, 2020·5 cites·15 claims
- 1183US6590269B1Package structure for a photosensitive chipKINGPAK TECH INC·Filed 2002·Granted Jul 8, 2003·46 cites·2 claims
- 1282US8563350B2Wafer level image sensor packaging structure and manufacturing method for the sameTU HSIU-WEN·Filed 2010·Granted Oct 22, 2013·7 cites·16 claims
- 1382US6627983B2Stacked package structure of image sensorFiled 2001·Granted Sep 30, 2003·43 cites·12 claims
- 1480US6646316B2Package structure of an image sensor and packagingKINGPAK TECH INC·Filed 2001·Granted Nov 11, 2003·35 cites·2 claims
- 1579US8441086B2Image sensor packaging structure with predetermined focal lengthTU HSIU-WEN·Filed 2010·Granted May 14, 2013·6 cites·4 claims
- 1679US8390087B2Image sensor package structure with large air cavityTU HSIU-WEN·Filed 2010·Granted Mar 5, 2013·7 cites·13 claims
- 1778US10170508B2Optical package structureKINGPAK TECH INC·Filed 2017·Granted Jan 1, 2019·4 cites·11 claims
- 1877US6870208B1Image sensor moduleKINGPAK TECH INC·Filed 2003·Granted Mar 22, 2005·25 cites·4 claims
- 1974US10964615B2Chip-scale sensor package structureKINGPAK TECH INC·Filed 2019·Granted Mar 30, 2021·2 cites·11 claims
- 2074US10720370B2Sensor package structureKINGPAK TECH INC·Filed 2018·Granted Jul 21, 2020·2 cites·7 claims
- 2173US8928104B2Image sensor packaging structure with black encapsulantTU HSIU-WEN·Filed 2010·Granted Jan 6, 2015·4 cites·12 claims
- 2273US6737720B2Packaging structure of image sensor and method for packaging the sameFiled 2001·Granted May 18, 2004·22 cites·11 claims
- 2370US8093674B2Manufacturing method for molding image sensor package structure and image sensor package structure thereofTU HSIU-WEN·Filed 2009·Granted Jan 10, 2012·5 cites·11 claims
- 2468US6874227B2Method for packaging an image sensorKINGPAK TECH INC·Filed 2003·Granted Apr 5, 2005·17 cites·4 claims
- 2567US8847146B2Image sensor package structure with casing including a vent without sealing and in communication with package materialTU HSIU-WEN·Filed 2009·Granted Sep 30, 2014·4 cites·7 claims
- 2666US10825851B2Sensor package structureKINGPAK TECH INC·Filed 2019·Granted Nov 3, 2020·1 cites·7 claims
- 2766US10700111B2Optical sensorKINGPAK TECH INC·Filed 2019·Granted Jun 30, 2020·1 cites·9 claims
- 2866US10236313B2Sensor package structureKINGPAK TECH INC·Filed 2017·Granted Mar 19, 2019·1 cites·5 claims
- 2966US10186538B2Sensor package structureKINGPAK TECH INC·Filed 2017·Granted Jan 22, 2019·1 cites·14 claims
- 3059US9184331B2Method for reducing tilt of optical unit during manufacture of image sensorKINGPAK TECH INC·Filed 2013·Granted Nov 10, 2015·1 cites·20 claims
- 3145US8828777B2Wafer level image sensor packaging structure and manufacturing method of the sameTU HSIU-WEN·Filed 2011·Granted Sep 9, 2014·0 cites·16 claims
- 3245US8378441B2Manufacturing method and structure of a wafer level image sensor module with package structureKINGPAK TECH INC·Filed 2011·Granted Feb 19, 2013·0 cites·20 claims
- 3345US6565008B2Module card and a method for manufacturing the sameKINGPAK TECH INC·Filed 2000·Granted May 20, 2003·3 cites·10 claims
- 3444US2009045476A1Image sensor package and method for forming the sameKINGPAK TECH INC·Filed 2007·Application pending·0 cites
- 3543US2008067334A1Image sensor package structure and method for manufacturing the sameCHUANG JASON·Filed 2007·Application pending·0 cites
- 3641US8703519B1Structure and manufacturing method for high resolution camera moduleKINGPAK TECH INC·Filed 2013·Granted Apr 22, 2014·0 cites·10 claims
- 3740US10600830B2Sensor package structureKINGPAK TECH INC·Filed 2017·Granted Mar 24, 2020·0 cites·9 claims
- 3840US2007241272A1Image sensor package structure and method for manufacturing the sameCHUANG JASON·Filed 2006·Application pending·0 cites
- 3940US2007096280A1Image sensor module structure and a method for manufacturing the sameTU HSIU W·Filed 2005·Application pending·0 cites
- 4040US2007108544A1Image sensor with a compound structureTU HSIU W·Filed 2005·Application pending·0 cites
- 4137US2004113048A1Image sensor moduleFiled 2002·Application pending·0 cites
- 4237US2004113047A1Image sensor moduleFiled 2002·Application pending·0 cites
- 4337US2002173071A1Method for packaging an image sensorFiled 2002·Application pending·0 cites
- 4437US2004089927A1Modularized image sensorFiled 2002·Application pending·0 cites
- 4534US2004251510A1Package structure of an image sensor moduleFiled 2003·Application pending·0 cites
- 4634US2003116846A1Stacked structure of a ball grid array (BGA) integrated circuit packageFiled 2001·Application pending·0 cites
- 4733US2002096782A1Package structure of an image sensor and method for packaging the sameFiled 2001·Application pending·0 cites
- 4833US2002060287A1Structure of a photosensor and method for packaging the sameFiled 2001·Application pending·0 cites
- 4932US2003116817A1Image sensor structureFiled 2001·Application pending·0 cites
- 5032US2002043709A1Stackable integrated circuitFiled 2001·Application pending·0 cites
Showing the top 50 of 53 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Hsiu-Wen Tu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →