Inventor · disambiguated record
Hsi-Chen Yang
Also filed as: YANG HSI-CHEN
1 granted patent·4 pending applications·1 citations·filing 2006–2011
17Inventor score
Top patents by PatentIndex Score
5 records- 0149US7884467B2Package structure of a microphoneLINGSEN PRECISION IND LTD·Filed 2008·Granted Feb 8, 2011·1 cites·14 claims
- 0233US2007182002A1Package structure of a microphoneHUANG CHIN-CHING·Filed 2006·Application pending·0 cites
- 0326US2009020500A1Method of forming passage through substrate for mems moduleLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
- 0421US2009020501A1Method of forming passage in substrate for mems moduleLINGSEN PREC IND·Filed 2007·Application pending·0 cites
- 0516US2012273931A1Integrated circuit chip package and manufacturing method thereofYANG HSI-CHEN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →