Package structure of a microphone

Abstract

A kind of microphone package structure is disclosed. It comprises at least of a substrate, a sound processing unit, an upper cap and other devices. There would be at least one trench set on the substrate, and a separation gap between the trench and the bounding pad of the substrate is maintained. After connective paste is smeared on the surface of the substrate, the trench would be assembled with other devices. This kind of package structure could prevent a short circuit being caused by the overflowing of the connective paste.

1 . A microphone package structure, comprising: 
 a substrate, including plural bounding pads and a connective area, and these bounding pads and the connective area are located in the different planes; besides, the connective area is smeared with a conductive paste;    a sound processing unit, set on the substrate, and connecting with plural bounding pads by plural wires; and    an upper cap, located with the connective area of the substrate.    
   
   
       2 . The microphone package structure of  claim 1 , wherein the substrate and the upper cap are both rectangles.  
   
   
       3 . The microphone package structure of  claim 1 , wherein the substrate and the upper cap are both non-rectangles.  
   
   
       4 . The microphone package structure of  claim 1 , wherein the connective area of the substrate and the upper cap is an interactive inclined plane.  
   
   
       5 . The microphone package structure of  claim 2 , wherein the connective area of the substrate and the upper cap is an interactive inclined plane.  
   
   
       6 . The microphone package structure of  claim 3 , wherein the connective area of the substrate and the upper cap is an interactive inclined plane.  
   
   
       7 . The microphone package structure of  claim 1 , wherein the connective area of the substrate is a concave inclined plane.  
   
   
       8 . The microphone package structure of  claim 2 , wherein the connective area of the substrate is a concave inclined plane.  
   
   
       9 . The microphone package structure of  claim 3 , wherein the connective area of the substrate is a concave inclined plane.  
   
   
       10 . The microphone package structure of  claim 1 , wherein the connective area of the substrate is a concave inclined plane, and is an interactive inclined plane with the connective area of the upper cap.  
   
   
       11 . The microphone package structure of  claim 2 , wherein the connective area of the substrate is a concave inclined plane, and is an interactive inclined plane with the connective area of the upper cap.  
   
   
       12 . The microphone package structure of  claim 3 , wherein the connective area of the substrate is a concave inclined plane, and is an interactive inclined plane with the connective area of the upper cap.  
   
   
       13 . A microphone package structure, comprising: 
 a substrate, including plural bounding pads and a connective area, and these bounding pads and the connective area are located in the different planes; besides, the connective area is smeared with conductive paste;    a sound processing unit, set on the substrate, and connecting with plural bounding pads by plural wires, and    an upper cap, located with the connective area of the substrate.    
   
   
       14 . The microphone package structure of  claim 13 , wherein the substrate and the upper cap are both rectangles.  
   
   
       15 . The microphone package structure of  claim 13 , wherein the substrate and the upper cap are both non-rectangles.  
   
   
       16 . The microphone package structure of  claim 13 , wherein the connective area of the substrate and the upper cap is an interactive inclined plane.  
   
   
       17 . The microphone package structure of  claim 14 , wherein the connective area of the substrate and the upper cap is an interactive inclined plane.  
   
   
       18 . The microphone package structure of  claim 15 , wherein the connective area of the substrate and the upper cap is an interactive inclined plane.  
   
   
       19 . The microphone package structure of  claim 13 , wherein the connective area of the substrate is a concave inclined plane.  
   
   
       20 . The microphone package structure of  claim 14 , wherein the connective area of the substrate is a concave inclined plane.  
   
   
       21 . The microphone package structure of  claim 15 , wherein the connective area of the substrate is a concave inclined plane.  
   
   
       22 . The microphone package structure of  claim 13 , wherein the connective area of the substrate is a concave inclined plane, and is an interactive inclined plane with the connective area of the upper cap.  
   
   
       23 . The microphone package structure of  claim 14 , wherein the connective area of the substrate is a concave inclined plane, and is an interactive inclined plane with the connective area of the upper cap.  
   
   
       24 . The microphone package structure of  claim 15 , wherein the connective area of the substrate is a concave inclined plane, and is an interactive inclined plane with the connective area of the upper cap.  
   
   
       25 . The microphone package structure of  claim 13 , wherein there is a protrusion between the pair of the connective areas.  
   
   
       26 . The microphone package structure of  claim 25 , wherein the protrusion is a rectangle.