Inventor · disambiguated record
Jiung-Yue Tien
Also filed as: TIEN JIUNG-YUE
2 granted patents·6 pending applications·2 citations·filing 2006–2008
41Inventor score
Top patents by PatentIndex Score
8 records- 0149US7884467B2Package structure of a microphoneLINGSEN PRECISION IND LTD·Filed 2008·Granted Feb 8, 2011·1 cites·14 claims
- 0248US7511373B2Cap package for micro electro-mechanical systemLINGSEN PREC INDUCTRIES LTD·Filed 2007·Granted Mar 31, 2009·1 cites·4 claims
- 0339US2008164583A1Chip package capable of minimizing electro-magnetic interferenceLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
- 0439US2009180655A1Package for mems microphoneLINGSEN PRECISION IND LTD·Filed 2008·Application pending·0 cites
- 0538US2007165898A1Acoustic head structure of a microphoneHUANG CHIN-CHING·Filed 2006·Application pending·0 cites
- 0637US2008079141A1Micro electro-mechanical system module package capable of minimizing interference of noisesLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
- 0737US2008164602A1Cap package for micro electro-mechanical system capable of minimizing electro-magnetic interferenceLINGSEN PRECISION IND LTD·Filed 2007·Application pending·0 cites
- 0833US2007182002A1Package structure of a microphoneHUANG CHIN-CHING·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →