Inventor · disambiguated record
Hui-Pin Chen
Also filed as: CHEN HUI · CHEN HUI-PIN
8 granted patents·9 pending applications·32 citations·filing 2000–2021
82Inventor score
Files withORIENT SEMICONDUCTOR ELECT LTD5ADVANCED SEMICONDUCTOR ENG1GCL SYSTEM INTEGRATION TECH CO LTD1LELON ELECTRONICS CORP1MAANSHAN IRON & STEEL CO LTD1
Top patents by PatentIndex Score
17 records- 0159US6499648B2Method and device for making a metal bump with an increased heightORIENT SEMICONDUCTOR ELECT LTD·Filed 2001·Granted Dec 31, 2002·9 cites·1 claims
- 0252US6390356B1Method of forming cylindrical bumps on a substrate for integrated circuitsORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted May 21, 2002·5 cites·1 claims
- 0351US6567270B2Semiconductor chip package with cooling arrangementORIENT SEMICONDUCTOR ELECT LTD·Filed 2001·Granted May 20, 2003·6 cites·1 claims
- 0451US6358834B1Method of forming bumps on wafers or substratesORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted Mar 19, 2002·6 cites·2 claims
- 0549US12281369B2Extra thick hot rolled h section steel and production method thereforMAANSHAN IRON & STEEL CO LTD·Filed 2021·Granted Apr 22, 2025·0 cites·15 claims
- 0649US6274491B1Process of manufacturing thin ball grid array substratesORIENT SEMICONDUCTOR ELECT LTD·Filed 2000·Granted Aug 14, 2001·6 cites·1 claims
- 0742US11869726B2Stacked aluminum electrolytic capacitor and method for manufacturing the sameLELON ELECTRONICS CORP·Filed 2021·Granted Jan 9, 2024·0 cites·6 claims
- 0840US2007216003A1Semiconductor package with enhancing layer and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 0939US2013158489A1Intelligent nursing machineYING JIAWEI·Filed 2011·Application pending·0 cites
- 1034US2003059721A1Fabrication method of semiconductorFiled 2002·Application pending·0 cites
- 1134US2003006268A1Method and device for making a metal bump with an increased heightFiled 2001·Application pending·0 cites
- 1232US2004183179A1Package structure for a multi-chip integrated circuitFiled 2003·Application pending·0 cites
- 1332US2003160316A1Open-type multichips stack packagingFiled 2003·Application pending·0 cites
- 1431US2004082174A1Method of wire bonding of a semiconductor device for resolving oxidation of copper bonding padFiled 2003·Application pending·0 cites
- 1531US2002072216A1Manufacturing method for multilayer high density substrateFiled 2001·Application pending·0 cites
- 1630US2004082159A1Fabrication method for solder bump pattern of rear section wafer packageFiled 2003·Application pending·0 cites
- 1725US10665729B2Solar cell module and method for manufacturing the same technical fieldGCL SYSTEM INTEGRATION TECH CO LTD·Filed 2016·Granted May 26, 2020·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →