Inventor · disambiguated record
Hua Feng Chen
Also filed as: CHEN HUA · Chen hua-feng
53 granted patents·8 pending applications·173 citations·filing 2011–2024
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD31WISTRON CORP10INVENTEC PUDONG TECH CORP7ADLINK TECH INC2BROADCOM CORP2
Top patents by PatentIndex Score
61 records- 0197US9536980B1Gate spacers and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 3, 2017·44 cites·20 claims
- 0296US11908735B2Vias for cobalt-based interconnects and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·2 cites·20 claims
- 0396US10074558B1FinFET structure with controlled air gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·18 cites·20 claims
- 0494US9882023B2Sidewall spacers for self-aligned contactsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 30, 2018·16 cites·20 claims
- 0592US10764990B1Heat-dissipating module having an elastic mounting structureADLINK TECH INC·Filed 2019·Granted Sep 1, 2020·9 cites·10 claims
- 0692US10516030B2Contact plugs and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·10 cites·20 claims
- 0790US10872980B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 22, 2020·6 cites·20 claims
- 0890US8866235B2Source and drain dislocation fabrication in FinFETsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Oct 21, 2014·10 cites·19 claims
- 0989US9941125B2Method for integrated circuit patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 10, 2018·6 cites·20 claims
- 1088US10553481B2Vias for cobalt-based interconnects and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Feb 4, 2020·4 cites·20 claims
- 1187US11282751B2Dielectric fins with different dielectric constants and sizes in different regions of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 22, 2022·3 cites·20 claims
- 1286US10930752B2Contact plugs and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 23, 2021·4 cites·19 claims
- 1385US12444649B2Vias for cobalt-based interconnects and methods of fabrication thereofPARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2024·Granted Oct 14, 2025·0 cites·19 claims
- 1485US8932936B2Method of forming a FinFET deviceLIU CHIA-CHU·Filed 2012·Granted Jan 13, 2015·9 cites·19 claims
- 1584US10727061B2Method for integrated circuit patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 28, 2020·3 cites·20 claims
- 1682US11721763B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 8, 2023·1 cites·20 claims
- 1781US12469746B2Contact structure of a semiconductor devicePARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2023·Granted Nov 11, 2025·0 cites·18 claims
- 1880US10779434B2Backflow prevention device and server system using the sameWISTRON CORP·Filed 2018·Granted Sep 15, 2020·4 cites·20 claims
- 1980US10297669B2Substrate resistor and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 21, 2019·2 cites·20 claims
- 2079US2024379452A1Dielectric Fins With Different Dielectric Constants and Sizes in Different Regions of a Semiconductor DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2178US12288822B2Semiconductor device with source/drain contactTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 29, 2025·0 cites·20 claims
- 2278US10863649B2Air generating system for reservoir tank, immersion cooling apparatus having the same, and method for operating the sameWISTRON CORP·Filed 2019·Granted Dec 8, 2020·2 cites·16 claims
- 2378US8897012B2Electronic device and heat dissipation module thereofINVENTEC PUDONG TECH CORP·Filed 2012·Granted Nov 25, 2014·2 cites·20 claims
- 2477US9282679B2Electronic device with phase change material microcapsule layerINVENTEC PUDONG TECH CORP·Filed 2014·Granted Mar 8, 2016·4 cites·9 claims
- 2575US11854875B2Contact structure of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2675US11280565B2Adapting device and heat dissipation system having the sameWISTRON CORP·Filed 2019·Granted Mar 22, 2022·2 cites·6 claims
- 2774US12453164B2Dielectric fins with different dielectric constants and sizes in different regions of a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 2874US8514108B2Single stage and scalable serializerChen hua-feng·Filed 2011·Granted Aug 20, 2013·6 cites·20 claims
- 2972US10720358B2Semiconductor device having a liner layer with a configured profile and method of fabricating thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 21, 2020·1 cites·20 claims
- 3071US11804402B2FinFET structure with controlled air gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 31, 2023·0 cites·20 claims
- 3169US10681800B1Thermal module mounting structureADLINK TECH INC·Filed 2019·Granted Jun 9, 2020·1 cites·8 claims
- 3268US9255585B2Fan structure and casing structureINVENTEC PUDONG TECH CORP·Filed 2013·Granted Feb 9, 2016·2 cites·5 claims
- 3366US11217477B2Semiconductor device having a liner layer with a configured profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 4, 2022·0 cites·20 claims
- 3465US11862708B2Contact plugs and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·20 claims
- 3564US11404309B2Vias for cobalt-based interconnects and methods of fabrication thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 2, 2022·0 cites·20 claims
- 3664US9235242B2Heat dissipating module having enhanced heat dissipating efficiencyYANG WEN-HSIUNG·Filed 2012·Granted Jan 12, 2016·2 cites·5 claims
- 3763US12464751B2Contact plugs and methods forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
- 3863US10872963B2Substrate resistor and method of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 22, 2020·0 cites·20 claims
- 3962US12376263B2Liquid cooling device applied to a plurality of optical transceivers and related electronic apparatusWISTRON CORP·Filed 2022·Granted Jul 29, 2025·0 cites·20 claims
- 4062US11545390B2Method of fabricating a semiconductor device having a liner layer with a configured profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 3, 2023·0 cites·20 claims
- 4159US12029007B2Cooling system and cooling deviceWISTRON CORP·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 4259US11251181B2FinFET isolation structure and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 15, 2022·0 cites·20 claims
- 4359US10879110B2FinFET structure with controlled air gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 29, 2020·0 cites·20 claims
- 4458US9230828B2Source and drain dislocation fabrication in FinFETsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jan 5, 2016·0 cites·20 claims
- 4556US11129306B1Fluid distribution apparatus and fluid distribution module with chokeWISTRON CORP·Filed 2020·Granted Sep 21, 2021·0 cites·15 claims
- 4655USRE48304ESource and drain dislocation fabrication in FinFETsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 10, 2020·0 cites·40 claims
- 4753US2023260796A1Method of manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4852US2025203811A1Cooling system and liquid cooling deviceWISTRON CORP·Filed 2024·Application pending·0 cites
- 4952US2014116655A1Heat dissipation moduleINVENTEC PUDONG TECH CORP·Filed 2013·Application pending·0 cites
- 5051US10510751B2FinFET isolation structure and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·0 cites·20 claims
Showing the top 50 of 61 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →