Inventor · disambiguated record
Hua-An Dai
Also filed as: DAI HUA-AN
2 granted patents·3 pending applications·21 citations·filing 2012–2013
59Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0190US8501614B1Method for manufacturing fine-pitch bumps and structure thereofSHIH CHENG-HUNG·Filed 2012·Granted Aug 6, 2013·16 cites·7 claims
- 0277US8530344B1Method for manufacturing fine-pitch bumps and structure thereofSHIH CHENG-HUNG·Filed 2012·Granted Sep 10, 2013·5 cites·7 claims
- 0347US2013256882A1Method for manufacturing fine-pitch bumps and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 0447US2013249089A1Method for manufacturing fine-pitch bumps and structure thereofCHIPBOND TECHNOLOGY CORP·Filed 2013·Application pending·0 cites
- 0535US2013183823A1Bumping processKUO CHIH-MING·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →