Inventor · disambiguated record
Hul-Chun Hsu
Also filed as: HSU HUL C · HSU HUL CHUN
27 granted patents·33 pending applications·362 citations·filing 2000–2010
97Inventor score
Top patents by PatentIndex Score
60 records- 0193US7086454B1Wick structure of heat pipeJAFFE LTD·Filed 2005·Granted Aug 8, 2006·23 cites·6 claims
- 0292US7073257B1Shrinkage-free sealing method and structure of heat pipeJAFFE LTD·Filed 2005·Granted Jul 11, 2006·28 cites·3 claims
- 0392US6382306B1Geometrical streamline flow guiding and heat-dissipating structureFiled 2000·Granted May 7, 2002·68 cites·16 claims
- 0490US7159647B2Heat pipe assemblyHSU HUL-CHUN·Filed 2005·Granted Jan 9, 2007·16 cites·14 claims
- 0586US7192064B2Extrusion-sealed structure of heat pipeHSU HUL-CHUN·Filed 2005·Granted Mar 20, 2007·12 cites·1 claims
- 0685US7322402B2Heat pipe structure and method for fabricating the sameHSU HUL-CHUN·Filed 2005·Granted Jan 29, 2008·13 cites·16 claims
- 0782US7849598B2Method for manufacturing an isothermal plateJAFFE LTD·Filed 2006·Granted Dec 14, 2010·7 cites·7 claims
- 0882US7275588B2Planar heat pipe structureHSU HUL-CHUN·Filed 2004·Granted Oct 2, 2007·26 cites·10 claims
- 0981US7823286B2Method for disposing wick structure in a heat pipe body assemblyJAFFE LTD·Filed 2007·Granted Nov 2, 2010·6 cites·6 claims
- 1081US6324060B1Heat transfer interfaceFiled 2000·Granted Nov 27, 2001·31 cites·3 claims
- 1177US7354193B2Clamping device with flexible contact for heat pipeJAFFE LTD·Filed 2005·Granted Apr 8, 2008·10 cites·4 claims
- 1275US7040382B2End surface capillary structure of heat pipeHSU HUL-CHUN·Filed 2004·Granted May 9, 2006·19 cites·14 claims
- 1371US7229104B2Shrinkage-free sealing structure of heat pipeHSU HUL-CHUN·Filed 2004·Granted Jun 12, 2007·16 cites·5 claims
- 1471US6997243B2Wick structure of heat pipeHSU HUL-CHUN·Filed 2004·Granted Feb 14, 2006·15 cites·7 claims
- 1567US6986383B2End surface structure of a heat pipe for contact with a heat sourceHSU HUL-CHUN·Filed 2004·Granted Jan 17, 2006·13 cites·9 claims
- 1666US7900353B2Method for combining axially heated heat pipes and heat-conducting baseJAFFE LTD·Filed 2006·Granted Mar 8, 2011·2 cites·6 claims
- 1765US7140421B2Wick structure of heat pipeHSU HUL-CHUN·Filed 2004·Granted Nov 28, 2006·11 cites·2 claims
- 1862US7040389B2Integrated heat dissipation apparatusHSU HUL-CHUN·Filed 2004·Granted May 9, 2006·10 cites·13 claims
- 1961US7150350B2Processing apparatus with conveying unit for continuously conveying heat pipesHSU HUL-CHUN·Filed 2005·Granted Dec 19, 2006·4 cites·6 claims
- 2060US6983791B2Heat pipe having fiber wick structureHSU HUL CHUN·Filed 2003·Granted Jan 10, 2006·9 cites·6 claims
- 2159US7137441B2End surface capillary structure of heat pipeHSU HUL-CHUN·Filed 2004·Granted Nov 21, 2006·8 cites·10 claims
- 2257US7650915B2Method for removing vapor within heat pipeHSU HUL-CHUN·Filed 2006·Granted Jan 26, 2010·1 cites·7 claims
- 2357US7147044B2Processing apparatus for continuously conveying heat pipesHSU HUL-CHUN·Filed 2005·Granted Dec 12, 2006·1 cites·4 claims
- 2456US2008105405A1Heat Pipe Multilayer Capillary Wick Support StructureHSU HUL-CHUN·Filed 2006·Application pending·0 cites
- 2555US7013957B2End surface structure of heat pipeHSU HUL-CHUN·Filed 2004·Granted Mar 21, 2006·6 cites·9 claims
- 2655US2006243426A1Wick Structure of Heat PipeHSU HUL-CHUN·Filed 2006·Application pending·0 cites
- 2754US7018585B2Annealing apparatusHSU HUL-CHUN·Filed 2004·Granted Mar 28, 2006·2 cites·18 claims
- 2854US2006177340A1Apparatus and method for sintering metallic web heat pipeJAFFE LTD·Filed 2005·Application pending·0 cites
- 2954US2006177299A1Method and apparatus for preserving semi-manufactured heat pipeJAFFE LTD·Filed 2005·Application pending·0 cites
- 3053US7149083B2Heat dissipation structureHSU HUL-CHUN·Filed 2004·Granted Dec 12, 2006·5 cites·13 claims
- 3153US2006278383A1Sealing method and structure of heat pipeJAFFE LTD·Filed 2005·Application pending·0 cites
- 3253US2006213646A1Wick structure of heat pipeJAFFE LTD·Filed 2005·Application pending·0 cites
- 3353US2007234566A1Method for adhering a heat pipe wall and a wick structureJAFFE LTD·Filed 2006·Application pending·0 cites
- 3453US2006260786A1Composite wick structure of heat pipeFAFFE LTD·Filed 2005·Application pending·0 cites
- 3552US2006162160A1Gas removal method and apparatus for heat pipeHSU HUL-CHUN·Filed 2005·Application pending·0 cites
- 3652US2009072534A1Sealed structure of circular tubular heat pipeHSU HUL-CHUN·Filed 2008·Application pending·0 cites
- 3752US2006207749A1Multi-layer wick structure of heat pipeJAFFE LTD·Filed 2005·Application pending·0 cites
- 3848US2007246510A1Rotating type soldering deviceJAFFE LTD·Filed 2006·Application pending·0 cites
- 3948US2007235498A1Rotating type soldering deviceJAFFE LTD·Filed 2006·Application pending·0 cites
- 4048US2007235499A1Rotating type soldering deviceJAFFE LTD·Filed 2006·Application pending·0 cites
- 4148US2007235497A1Rotating type soldering deviceJAFFE LTD·Filed 2006·Application pending·0 cites
- 4246US2006174478A1Apparatus for disposing capillary structure into heat pipeJAFFE LTD·Filed 2005·Application pending·0 cites
- 4346US2006202000A1Eccentric rotation soldering method and apparatusHSU HUL-CHUN·Filed 2005·Application pending·0 cites
- 4446US2007228116A1Method for adhering a heat pipe wall and a wick structureJAFFE LTD·Filed 2006·Application pending·0 cites
- 4545US2010193161A1Heat Pipe Body Assembly Having Wick StructureHSU HUL-CHUN·Filed 2010·Application pending·0 cites
- 4644US7231715B2Method for forming end surface of heat pipe and structure thereofHSU HUL-CHUN·Filed 2004·Granted Jun 19, 2007·0 cites·2 claims
- 4743US2008035313A1Heat-Conducting Base and Isothermal Plate having the sameHSU HUL-CHUN·Filed 2006·Application pending·0 cites
- 4843US2005145368A1Heat pipe structureFiled 2003·Application pending·0 cites
- 4943US2008035310A1Isothermal Plate ModuleHSU HUL-CHUN·Filed 2006·Application pending·0 cites
- 5043US2005051305A1Heat pipeFiled 2003·Application pending·0 cites
Showing the top 50 of 60 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →