Method for manufacturing an isothermal plate

Abstract

A method for manufacturing an isothermal plate includes the steps of preparing a plurality of heat pipes, a first plate body and a second plate body; pressing on the second plate body to form a plurality of shielding covers recessed into the bottom surface of the second plate body and protruding from the top surface of the second plate body, the recessed portion of each shielding cover having a cambered space for horizontally accommodating the heat pipe therein; disposing each heat pipe into each cambered space to make the first plate body adhered to the bottom surface of the second plate body and the two plate bodies overlapped with each other; and applying an external force to the second plate body to bring each heat pipe into a tight and planar contact with the inner wall of its corresponding cambered space in the direction of pressing.

1. A method for manufacturing an isothermal plate, comprising the steps of:
 preparing a plurality of heat pipes, a first plate body and a second plate body; 
 pressing on the second plate body to form a plurality of shielding covers recessed into the bottom surface of the second plate body and protruding from the top surface of the second plate body, a recessed portion of each shielding cover having a cambered space for horizontally accommodating the heat pipe therein; 
 disposing each heat pipe into each cambered space to make the first plate body adhered to the bottom surface of the second plate body; and 
 applying an external force to the second plate body to bring each heat pipe into a tight and planar contact with an inner wall of a corresponding cambered space in the direction of the applied external force. 
 
     
     
       2. The method for manufacturing the isothermal plate according to  claim 1 , further comprising the step of applying a soldering material on each heat pipe or the first and the second plate bodies so that the soldering material is heated to be melted to fill a gap between the heat pipes and the shielding covers. 
     
     
       3. The method for manufacturing the isothermal plate according to  claim 2 , wherein the soldering material is a soldering paste. 
     
     
       4. The method for manufacturing the isothermal plate according to  claim 1 , wherein the first and second plate bodies are made of materials selected from the group consisting of aluminum and copper. 
     
     
       5. The method for manufacturing the isothermal plate according to  claim 1 , further comprising the step of providing a necessary connection for the first and the second plate bodies to allow the two plate bodies to overlap with each other. 
     
     
       6. The method for manufacturing the isothermal plate according to  claim 1 , further comprising the step of providing fine holes on the inner wall of each shielding cover, and injecting a heat-conducting medium into the fine holes to flow into a gap between the heat pipes and the shielding covers after the step of applying the external force to the second plate body. 
     
     
       7. The method for manufacturing the isothermal plate according to  claim 1 , further comprising the step of applying a heat-conducting paste on each heat pipe or the first and the second plate bodies.