Inventor · disambiguated record
Hung-Jen Hsu
Also filed as: HSU HUNG-JEN
23 granted patents·7 pending applications·141 citations·filing 2000–2025
94Inventor score
Top patents by PatentIndex Score
30 records- 0188US2025364495A1Multi-wafer integrationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0284US11031556B2Systems and methods for phase change material based thermal assessmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 8, 2021·2 cites·19 claims
- 0383US12463181B2Multi-wafer integrationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 0479US9437925B2Communication device and antenna element thereinACER INC·Filed 2014·Granted Sep 6, 2016·5 cites·8 claims
- 0576US12243890B2Semiconductor device structure and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 0676US6849533B2Method for fabricating microelectronic product with attenuated bond pad corrosionTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Feb 1, 2005·25 cites·17 claims
- 0776US2025160022A1Semiconductor device structure and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0875US7372497B2Effective method to improve sub-micron color filter sensitivityTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted May 13, 2008·23 cites·37 claims
- 0975US6964916B2Image sensor fabrication method and structureTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Nov 15, 2005·20 cites·13 claims
- 1075US2024387394A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1175US2023397509A1Systems and methods for phase change material based thermal assessmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1274US7507598B2Image sensor fabrication method and structureTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Mar 24, 2009·6 cites·12 claims
- 1373US11812674B2Systems and methods for phase change material based thermal assessmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·0 cites·20 claims
- 1473US11227887B2Semiconductor device structure and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 18, 2022·0 cites·20 claims
- 1572US11916043B2Multi-wafer integrationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·0 cites·20 claims
- 1671US10475835B2Semiconductor device structure and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 12, 2019·1 cites·19 claims
- 1768US7553689B2Semiconductor device with micro-lens and method of making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Jun 30, 2009·1 cites·20 claims
- 1868US6956253B2Color filter with resist material in scribe linesTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 18, 2005·13 cites·8 claims
- 1967US7126099B2Image sensor with improved uniformity of effective incident lightTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 24, 2006·15 cites·27 claims
- 2064US6861207B2Method for fabricating microlens with lithographic processTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Mar 1, 2005·12 cites·26 claims
- 2164US2023139843A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2259US6878642B1Method to improve passivation openings by reflow of photoresist to eliminate tape residueTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Apr 12, 2005·9 cites·20 claims
- 2357US7071032B2Material to improve image sensor yield during wafer sawingTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jul 4, 2006·5 cites·16 claims
- 2457US2024379543A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2552US6759276B1Material to improve CMOS image sensor yield during wafer sawingTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 6, 2004·4 cites·7 claims
- 2651US8129762B2Image sensorWENG FU-TIEN·Filed 2008·Granted Mar 6, 2012·0 cites·21 claims
- 2748US7508084B2CMOS image sensorTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Mar 24, 2009·0 cites·20 claims
- 2847US9865929B2Communication device and antenna element thereinACER INC·Filed 2013·Granted Jan 9, 2018·0 cites·9 claims
- 2946US9385419B2Wrist-worn communication deviceACER INC·Filed 2013·Granted Jul 5, 2016·0 cites·8 claims
- 3036US2005001281A1Process to improve image sensor sensitivityFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →