Inventor · disambiguated record
Huei-Nuan Huang
Also filed as: HUANG HUEI-NUAN
1 granted patent·3 pending applications·0 citations·filing 2011–2014
14Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0143US2013326873A1Method of fabricating multi-chip stack package structure having inner layer heat-dissipating boardSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 0237US8520391B2Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereofHUANG HUEI-NUAN·Filed 2011·Granted Aug 27, 2013·0 cites·15 claims
- 0337US2015162301A1Method for fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Application pending·0 cites
- 0429US2013256915A1Packaging substrate, semiconductor package and fabrication method thereofHUANG HUEI-NUAN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →