Inventor · disambiguated record
Hun Jeong
Also filed as: JEONG HUN · JEONG HUN SUB
5 granted patents·1 pending application·7 citations·filing 2010–2017
69Inventor score
Top patents by PatentIndex Score
6 records- 0181US8932908B2Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor dieSTATS CHIPPAC LTD·Filed 2013·Granted Jan 13, 2015·5 cites·30 claims
- 0264US8288202B2Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor dieLEE KYUWON·Filed 2010·Granted Oct 16, 2012·2 cites·20 claims
- 0348US2016076829A1Heat dissipating sheet3M INNOVATIVE PROPERTIES CO·Filed 2014·Application pending·0 cites
- 0447US8502392B2Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor dieLEE KYUWON·Filed 2012·Granted Aug 6, 2013·0 cites·25 claims
- 0545US10611319B2Door trim coupling device for a vehicleHYUNDAI MOTOR CO LTD·Filed 2017·Granted Apr 7, 2020·0 cites·10 claims
- 0640US10065578B2Door trim coupling device for a vehicleHYUNDAI MOTOR CO LTD·Filed 2017·Granted Sep 4, 2018·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →