Inventor · disambiguated record
Hung-Jui Kuo
Also filed as: KUO HUNG-JUI
358 granted patents·101 pending applications·961 citations·filing 1999–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD421TAIWAN SEMICONDUCTOR MFG16CHI MEI CORP3LEI YI-YANG3KUO HUNG-JUI2
Top patents by PatentIndex Score
459 records- 0199US11651994B2Processes for reducing leakage and improving adhesionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 16, 2023·5 cites·20 claims
- 0299US11454888B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·6 cites·20 claims
- 0399US9899248B2Method of forming semiconductor packages having through package viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 20, 2018·73 cites·20 claims
- 0499US9859206B2Photoactive compound gradient photoresistTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 2, 2018·70 cites·20 claims
- 0599US9793230B1Semiconductor structure and method of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 17, 2017·33 cites·20 claims
- 0698US11823981B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 21, 2023·5 cites·20 claims
- 0798US11721635B2Chip package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 8, 2023·3 cites·20 claims
- 0898US11508633B2Package structure having taper-shaped conductive pillar and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 22, 2022·7 cites·20 claims
- 0998US11289396B2Sensing component encapsulated by an encapsulation layer with a roughness surface having a hollow regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 29, 2022·13 cites·20 claims
- 1098US10622321B2Semiconductor structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 14, 2020·48 cites·20 claims
- 1198US10490521B2Advanced structure for info wafer warpage reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 26, 2019·43 cites·20 claims
- 1298US9659805B2Fan-out interconnect structure and methods forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 23, 2017·20 cites·20 claims
- 1398US8754508B2Structure to increase resistance to electromigrationCHEN HSIEN-WEI·Filed 2012·Granted Jun 17, 2014·49 cites·21 claims
- 1497US12087654B2Sensing die encapsulated by an encapsulant with a roughness surface having a hollow regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·4 cites·20 claims
- 1597US11894336B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·3 cites·20 claims
- 1697US11854927B2Semiconductor package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·3 cites·20 claims
- 1797US11764124B2Sensing component encapsulated by an encapsulant with a roughness surface having a hollow regionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 19, 2023·4 cites·20 claims
- 1897US11456280B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·4 cites·20 claims
- 1997US11251071B2Raised via for terminal connections on different planesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 2097US10658199B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 19, 2020·5 cites·20 claims
- 2197US10361122B1Processes for reducing leakage and improving adhesionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 23, 2019·14 cites·20 claims
- 2297US10163858B1Semiconductor packages and manufacturing methods thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·18 cites·20 claims
- 2397US9318429B2Integrated structure in wafer level packageTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 19, 2016·32 cites·20 claims
- 2496US12009331B2Integrated circuit packages having adhesion layers for through viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 11, 2024·2 cites·20 claims
- 2596US11996381B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·2 cites·20 claims
- 2696US11990383B2Package structure having at least one die with a plurality of taper-shaped die connectorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 21, 2024·2 cites·20 claims
- 2796US11961777B2Package structure comprising buffer layer for reducing thermal stress and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 16, 2024·2 cites·20 claims
- 2896US11841618B2Photoresist system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 12, 2023·2 cites·20 claims
- 2996US11798893B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 24, 2023·2 cites·20 claims
- 3096US11798857B2Composition for sacrificial film, package, manufacturing method of packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 24, 2023·4 cites·20 claims
- 3196US11791313B2Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 17, 2023·2 cites·20 claims
- 3296US11789366B2Method for removing resist layer, and method of manufacturing semiconductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 17, 2023·2 cites·20 claims
- 3395US11942435B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 26, 2024·2 cites·20 claims
- 3495US11322450B2Chip package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 3, 2022·8 cites·20 claims
- 3595US10964591B2Processes for reducing leakage and improving adhesionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 30, 2021·7 cites·20 claims
- 3695US10833053B1Semiconductor package and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 10, 2020·10 cites·20 claims
- 3795US10276543B1Semicondcutor device package and method of forming semicondcutor device packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·13 cites·20 claims
- 3894US12218009B2Semiconductor package and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·1 cites·20 claims
- 3994US11892774B2LithographyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·2 cites·20 claims
- 4094US10872864B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 22, 2020·10 cites·20 claims
- 4194US10515848B1Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·9 cites·20 claims
- 4294US10304700B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 28, 2019·10 cites·24 claims
- 4393US12165966B2Package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 10, 2024·2 cites·20 claims
- 4493US11973023B2Stacked via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 30, 2024·2 cites·20 claims
- 4593US11557561B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 17, 2023·2 cites·20 claims
- 4693US11114407B2Integrated fan-out package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 7, 2021·7 cites·20 claims
- 4793US10707094B2Semiconductor package and manufacturing process thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 7, 2020·6 cites·20 claims
- 4893US10510645B2Planarizing RDLs in RDL-first processes through CMP processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·7 cites·20 claims
- 4993US10340206B2Dense redistribution layers in semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 2, 2019·6 cites·20 claims
- 5093US10297544B2Integrated fan-out package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 21, 2019·7 cites·20 claims
Showing the top 50 of 459 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →