Inventor · disambiguated record

Hung-Yi Kuo

Also filed as: KUO HUNG-YI

150 granted patents·43 pending applications·418 citations·filing 2002–2025

99Inventor score

Technology areasH10W G02B G06F H10P H10D

Files withTAIWAN SEMICONDUCTOR MFG CO LTD143 VIA TECH INC15 TAIWAN SEMICONDUCTOR MFG9 TSMC SOLID STATE LIGHTING LTD7 CHERN CHYI-SHYUAN3

Top patents by PatentIndex Score

193 records

0198US11508656B2Semiconductor package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 22, 2022·8 cites·20 claims
0298US11139249B2Semiconductor devices and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 5, 2021·6 cites·20 claims
0397US12038599B2Photonic package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 16, 2024·3 cites·20 claims
0497US11809000B2Photonic integrated circuit and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 7, 2023·4 cites·20 claims
0597US11664325B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 30, 2023·3 cites·20 claims
0697US11244906B2Semiconductor structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 8, 2022·5 cites·15 claims
0797US8241932B1Methods of fabricating light emitting diode packagesYU CHIH-KUANG·Filed 2011·Granted Aug 14, 2012·49 cites·20 claims
0896US11848319B2Multi-chip semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·2 cites·20 claims
0996US11506843B1Semiconductor device having photonic and electronic dies and an optical fiber assembly creating an air gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 22, 2022·5 cites·20 claims
1096US11251119B2Package structure, package-on-package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
1196US9761522B2Wireless charging package with chip integrated in coil centerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 12, 2017·19 cites·20 claims
1296US9640498B1Integrated fan-out (InFO) package structures and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 2, 2017·20 cites·20 claims
1395US11848288B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 19, 2023·2 cites·20 claims
1495US11614592B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 28, 2023·3 cites·20 claims
1594US10790244B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·8 cites·21 claims
1694US10163780B2Wireless charging package with chip integrated in coil centerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·9 cites·20 claims
1793US10115685B2Method of manufacturing a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 30, 2018·6 cites·20 claims
1893US10074472B2InFO coil on metal plate with slotTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 11, 2018·8 cites·20 claims
1993US9305877B13D package with through substrate viasTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Apr 5, 2016·14 cites·20 claims
2092US12222545B2Package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 11, 2025·1 cites·20 claims
2192US11495590B2Multi-chip semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 8, 2022·2 cites·20 claims
2292US10847505B2Multi-chip semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 24, 2020·6 cites·20 claims
2392US8604491B2Wafer level photonic device die structure and method of making the sameYU CHIH-KUANG·Filed 2011·Granted Dec 10, 2013·7 cites·20 claims
2491US9490203B2Capacitor in post-passivation structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 8, 2016·5 cites·20 claims
2590US10497646B2Dual-mode wireless charging deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 3, 2019·5 cites·20 claims
2690US9953936B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 24, 2018·5 cites·14 claims
2790US9245842B2Semiconductor devices having guard ring structure and methods of manufacture thereofTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jan 26, 2016·10 cites·20 claims
2889US8587018B2LED structure having embedded zener diodeHSIA SHOULI STEVE·Filed 2011·Granted Nov 19, 2013·11 cites·19 claims
2989US7610497B2Power management system with a bridge logic having analyzers for monitoring data quantity to modify operating clock and voltage of the processor and main memoryVIA TECH INC·Filed 2005·Granted Oct 27, 2009·18 cites·19 claims
3088US11635566B2Package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 25, 2023·2 cites·20 claims
3188US10530175B2Hexagonal semiconductor package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 7, 2020·2 cites·18 claims
3288US7624286B2Power management method of north bridgeVIA TECH INC·Filed 2005·Granted Nov 24, 2009·16 cites·17 claims
3387US12374627B2Method of fabricating semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·20 claims
3487US9953892B2Polymer based-semiconductor structure with cavityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 24, 2018·4 cites·20 claims
3587US8236584B1Method of forming a light emitting diode emitter substrate with highly reflective metal bondingCHEM CHYI SHYUAN·Filed 2011·Granted Aug 7, 2012·18 cites·20 claims
3687US2025355169A1Photonic package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3786US2025355202A1Photonic integrated circuit and package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3886US2025347862A1Method of making semiconductor device including optical through via and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
3985US10128203B2Fan-out package structure, antenna system and associated methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 13, 2018·4 cites·18 claims
4085US9786591B2Capacitor in post-passivation structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 10, 2017·3 cites·20 claims
4184US12442978B2Photonic package and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
4284US12210200B2Photonic semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jan 28, 2025·0 cites·20 claims
4384US9000876B2Inductor for post passivation interconnectTSAI HAO-YI·Filed 2012·Granted Apr 7, 2015·6 cites·16 claims
4484US8598617B2Methods of fabricating light emitting diode packagesYU CHIH-KUANG·Filed 2012·Granted Dec 3, 2013·6 cites·20 claims
4584US7587651B2Method and related apparatus for calibrating signal driving parameters between chipsVIA TECH INC·Filed 2005·Granted Sep 8, 2009·15 cites·15 claims
4684US2025123458A1Photonic Semiconductor Device and Method of ManufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
4784US2025323148A1Dual-mode wireless charging deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
4883US12243681B2Programmable inductor and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
4983US8970001B2Guard ring design for maintaining signal integrityTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Mar 3, 2015·6 cites·20 claims
5083US2025096203A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites

Showing the top 50 of 193 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →