Inventor · disambiguated record
Hung-Jen Lee
Also filed as: LEE HUNG-JEN
6 granted patents·21 citations·filing 2011–2014
79Inventor score
Top patents by PatentIndex Score
6 records- 0187US8409925B2Chip package structure and manufacturing method thereofLEE HUNG-JEN·Filed 2011·Granted Apr 2, 2013·8 cites·18 claims
- 0285US8673686B2Chip package structure and manufacturing method thereofLEE HUNG-JEN·Filed 2012·Granted Mar 18, 2014·7 cites·14 claims
- 0374US8791768B2Capacitive coupler packaging structureYIU HO-YIN·Filed 2012·Granted Jul 29, 2014·4 cites·20 claims
- 0473US8779558B2Chip package structure and manufacturing method thereofXINTEC INC·Filed 2013·Granted Jul 15, 2014·2 cites·15 claims
- 0557US9054114B2Chip package structure and manufacturing method thereofXINTEC INC·Filed 2014·Granted Jun 9, 2015·0 cites·28 claims
- 0648US8928098B2Semiconductor package and fabrication method thereofXINTEC INC·Filed 2012·Granted Jan 6, 2015·0 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →