Inventor · disambiguated record
Hugh Li
Also filed as: LI HUGH
3 granted patents·76 citations·filing 1999–2003
74Inventor score
Top patents by PatentIndex Score
3 records- 0178US6358847B1Method for enabling conventional wire bonding to copper-based bond pad featuresLAM RES CORP·Filed 1999·Granted Mar 19, 2002·48 cites·33 claims
- 0269US6610601B2Bond pad and wire bondLAM RES CORP·Filed 2002·Granted Aug 26, 2003·15 cites·15 claims
- 0367US7300480B2High-rate barrier polishing compositionROHM & HAAS ELECT MAT·Filed 2003·Granted Nov 27, 2007·13 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →