Inventor · disambiguated record
Hui-Ting Lin
Also filed as: LIN HUI-TING
9 granted patents·6 pending applications·2 citations·filing 2018–2025
77Inventor score
Top patents by PatentIndex Score
15 records- 0191US12009337B2Bonding tool and bonding method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 11, 2024·2 cites·20 claims
- 0283US2025357418A1Bonding tool and bonding method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0380US12438118B2Bonding tool and bonding method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 7, 2025·0 cites·20 claims
- 0480US12293951B2Semiconductor package structure having ring portion with recess for adhesiveTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 6, 2025·0 cites·20 claims
- 0578US2025259904A1Semiconductor package structure having ring portion with recess for adhesiveTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0671US11749575B2Semiconductor package structure having ring portion with recess for adhesive and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·20 claims
- 0770US12506109B2Die bonding tool with tiltable bond head for improved bonding and methods for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 0869US2023369250A1Chip package structure with anchor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0967US11764168B2Chip package structure with anchor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 1066US11424408B2ReRAM structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Aug 23, 2022·0 cites·7 claims
- 1157US11165019B2ReRAM structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2019·Granted Nov 2, 2021·0 cites·9 claims
- 1255US2025054786A1Die bonding tool with movable component for improved die protrusion control and methods for using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1355US2025132284A1Die bonding tool with tiltable bond stage and methods for performing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1454US2025006690A1Post-plasma clean infrared image inspection for oxideless bonding and apparatus for effecting the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1540US11152295B2Semiconductor package structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 19, 2021·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →