Inventor · disambiguated record
Hung-Min Liu
Also filed as: LIU HUNG-MIN
6 granted patents·4 pending applications·41 citations·filing 2002–2024
78Inventor score
Files withUNITED MICROELECTRONICS CORP4CHUNGHWA PICTURE TUBES LTD1LIN CHIH-WEI1LIN ZONG-HUEI1PANJIT INT INC1
Top patents by PatentIndex Score
10 records- 0173US6881654B2Solder bump structure and laser repair process for memory deviceUNITED MICROELECTRONICS CORP·Filed 2002·Granted Apr 19, 2005·22 cites·9 claims
- 0267US7026234B2Parasitic capacitance-preventing dummy solder bump structure and method of making the sameUNITED MICROELECTRONICS CORP·Filed 2004·Granted Apr 11, 2006·14 cites·17 claims
- 0359US7268440B2Fabrication of semiconductor integrated circuit chipsUNITED MICROELECTRONICS CORP·Filed 2005·Granted Sep 11, 2007·2 cites·4 claims
- 0458US2025201752A1Semiconductor package structure and byproduct of semiconductor componentPANJIT INT INC·Filed 2024·Application pending·0 cites
- 0556US7008818B2Flip chip packaging process employing improved probe tip designUNITED MICROELECTRONICS CORP·Filed 2005·Granted Mar 7, 2006·3 cites·8 claims
- 0652US8755054B2Method of measuring surface structure of display deviceCHUNGHWA PICTURE TUBES LTD·Filed 2013·Granted Jun 17, 2014·0 cites·10 claims
- 0747US8605235B2Display device and method of measuring surface structure thereofLIN CHIH-WEI·Filed 2010·Granted Dec 10, 2013·0 cites·7 claims
- 0837US2006278957A1Fabrication of semiconductor integrated circuit chipsLIN ZONG-HUEI·Filed 2005·Application pending·0 cites
- 0932US2005002167A1Microelectronic packageFiled 2003·Application pending·0 cites
- 1025US2005032229A1Probe tip design applied in a flip chip packaging processFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →