Inventor · disambiguated record
Huang Liu
Also filed as: LIU HUANG · LIU HUANG-HUI
13 granted patents·4 pending applications·26 citations·filing 2000–2025
85Inventor score
Top patents by PatentIndex Score
17 records- 0188US11244947B1Semiconductor device for a volatile memory and method of manufacturing semiconductor deviceHEFECHIP CORPORATION LTD·Filed 2020·Granted Feb 8, 2022·2 cites·22 claims
- 0285US12092558B1Gas based testing method for pore volume compressibility of low-permeability rockUNIV SOUTHWEST PETROLEUM·Filed 2024·Granted Sep 17, 2024·1 cites·9 claims
- 0378US6451687B1Intermetal dielectric layer for integrated circuitsCHARTERED SEMICONDUCTOR MFG·Filed 2000·Granted Sep 17, 2002·19 cites·10 claims
- 0472US11049862B2Semiconductor device and fabrication method thereofHEFECHIP CORPORATION LTD·Filed 2019·Granted Jun 29, 2021·2 cites·8 claims
- 0569US12464699B2Semiconductor structure and forming method thereofHEFECHIP CORPORATION LTD·Filed 2022·Granted Nov 4, 2025·0 cites·8 claims
- 0667US12405236B1Method for measuring critical condensate saturation pressure and critical condensate saturation of condensate gas by combining one-dimensional and two-dimensional nuclear magnetic resonance techniquesUNIV SOUTHWEST PETROLEUM·Filed 2025·Granted Sep 2, 2025·0 cites·6 claims
- 0758US12436142B2Method of preparing degassed oil representative of live oil with equivalent minimum miscible pressureUNIV SOUTHWEST PETROLEUM·Filed 2023·Granted Oct 7, 2025·0 cites·3 claims
- 0854US12163905B2Method for determining phase-state type and saturation of fluid in tight reservoirs by NMR technologyUNIV SOUTHWEST PETROLEUM·Filed 2023·Granted Dec 10, 2024·0 cites·5 claims
- 0951US2023240065A1Method of forming plug for semiconductor device and semiconductor device thereofHEFECHIP CORPORATION LTD·Filed 2022·Application pending·0 cites
- 1050US2023317526A1Method to form semiconductor device and semiconductor device thereofHEFECHIP CORPORATION LTD·Filed 2022·Application pending·0 cites
- 1149US12125873B2Method to form a fin structure on deep trenches for a semiconductor deviceHEFECHIP CORPORATION LTD·Filed 2022·Granted Oct 22, 2024·0 cites·20 claims
- 1249US6528886B2Intermetal dielectric layer for integrated circuitsCHARTERED SEMICONDUCTOR MFG·Filed 2002·Granted Mar 4, 2003·2 cites·8 claims
- 1339US10364184B2Manufacturing method of big-model low-permeability microcrack coreUNIV SOUTHWEST PETROLEUM·Filed 2017·Granted Jul 30, 2019·0 cites·7 claims
- 1438US11459880B2Method for evaluating difference in gas injection effect of gas injection wells in carbonate reservoirUNIV SOUTHWEST PETROLEUM·Filed 2020·Granted Oct 4, 2022·0 cites·10 claims
- 1537US10746638B2Direct method for manufacturing large model fractured core and maintaining original oil-water saturationUNIV SOUTHWEST PETROLEUM·Filed 2016·Granted Aug 18, 2020·0 cites·4 claims
- 1633US2004037227A1Circuit for enhancing scan testing capability of a digital IC testerFiled 2002·Application pending·0 cites
- 1730US2002079539A1Method for fabricating an I/O pad with improved ESD toleranceFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →