Inventor · disambiguated record
Hui Liu
Also filed as: LIU HUI · Liu hui wen
12 granted patents·5 pending applications·48 citations·filing 2006–2024
88Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD5DENG ZHIGANG2AMPHENOL EAST ASIA ELECTRONIC TECHNOLOGY SHENZHEN CO LTD1CHEN HSIN-HSUN1CHIU CHIN-TIEN1
Top patents by PatentIndex Score
17 records- 0198US11309223B2Method of forming semiconductor device package having dummy devices on a first dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 19, 2022·7 cites·20 claims
- 0297US10672674B2Method of forming semiconductor device package having testing pads on a topmost dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 2, 2020·17 cites·20 claims
- 0388US11276958B2ConnectorMOLEX LLC·Filed 2020·Granted Mar 15, 2022·4 cites·14 claims
- 0481US12020997B2Methods of forming semiconductor device packages having alignment marks on a carrier substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 0577US11721598B2Method of forming semiconductor device package having testing pads on an upper dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 8, 2023·0 cites·20 claims
- 0675US9469554B2Bipolar electrode and supercapacitor desalination device, and methods of manufactureZHENG LIPING·Filed 2009·Granted Oct 18, 2016·5 cites·16 claims
- 0767US9127108B2Method for making polymer, and associated polymer, membrane and electrodeDENG ZHIGANG·Filed 2012·Granted Sep 8, 2015·1 cites·18 claims
- 0866US7435624B2Method of reducing mechanical stress on a semiconductor die during fabricationSANDISK CORP·Filed 2006·Granted Oct 14, 2008·4 cites·15 claims
- 0963US8641454B2Electrical connectorCHEN HSIN-HSUN·Filed 2012·Granted Feb 4, 2014·7 cites·9 claims
- 1063US2025267833A1Semiconductor device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1162US8211335B2Method for making polymer, coating electrode, and associated polymer and electrodeDENG ZHIGANG·Filed 2009·Granted Jul 3, 2012·3 cites·8 claims
- 1262US2024266393A1Metasurface structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 1349US2024097376A1Compact water resistance electrical connectorAMPHENOL EAST ASIA ELECTRONIC TECHNOLOGY SHENZHEN CO LTD·Filed 2023·Application pending·0 cites
- 1442US2014339163A1Performance of a membrane used in membrane distillationYU XIANGUO·Filed 2011·Application pending·0 cites
- 1540US8878346B2Molded SiP package with reinforced solder columnsCHIU CHIN-TIEN·Filed 2006·Granted Nov 4, 2014·0 cites·24 claims
- 1634US2013157510A1Electrical connectorHSU YA-HUI·Filed 2011·Application pending·0 cites
- 1727US10109132B2Sampling method and sampling apparatus for anti-counterfeiting information about cash noteGRG BANKING EQUIPMENT CO LTD·Filed 2015·Granted Oct 23, 2018·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →