Inventor · disambiguated record
Hua Pan
Also filed as: PAN HUA · PAN HUA-TSENG
23 granted patents·4 pending applications·244 citations·filing 1996–2024
95Inventor score
Files withHON HAI PREC IND CO LTD13ALPHA & OMEGA SEMICONDUCTOR3ZHEJIANG FULAI NEW MAT CO LTD2ALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD1ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD1
Top patents by PatentIndex Score
27 records- 0191US6020565ALow-mounting force keyswitchHON HAI PREC IND CO LTD·Filed 1998·Granted Feb 1, 2000·64 cites·4 claims
- 0286US9230949B2Method of making stacked multi-chip packaging structureALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted Jan 5, 2016·4 cites·9 claims
- 0384US9269699B2Embedded package and method thereofALPHA & OMEGA SEMICONDUCTOR·Filed 2014·Granted Feb 23, 2016·6 cites·18 claims
- 0481US9006870B2Stacked multi-chip packaging structure and manufacturing method thereofZHANG XIAOTIAN·Filed 2013·Granted Apr 14, 2015·4 cites·12 claims
- 0577US6060676AKeyswitch assemblyHON HAI PREC IND CO LTD·Filed 1998·Granted May 9, 2000·30 cites·6 claims
- 0665US6017248ACard edge connectorHON HAI PREC IND CO LTD·Filed 1997·Granted Jan 25, 2000·27 cites·12 claims
- 0761US2024318042A1Ultra-quiet backing-paper-free cold laminating film and preparation method thereofZHEJIANG FULAI NEW MAT CO LTD·Filed 2024·Application pending·0 cites
- 0858US5902143ARetainer for use with cardHON HAI PREC IND CO LTD·Filed 1996·Granted May 11, 1999·19 cites·4 claims
- 0956US11099095B2Flexible pressure sensor and fabrication method thereofZHEJIANG OUREN NEW MAT CO LTD·Filed 2019·Granted Aug 24, 2021·1 cites·10 claims
- 1053US5957722ALocking device for an electrical connectorHON HAI PREC IND CO LTD·Filed 1997·Granted Sep 28, 1999·19 cites·18 claims
- 1152US9646920B2Power semiconductor device with small contact footprint and the preparation methodALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD·Filed 2014·Granted May 9, 2017·0 cites·8 claims
- 1252US5820396ARetention device for card edge connectorHON HAI PREC IND CO LTD·Filed 1996·Granted Oct 13, 1998·18 cites·4 claims
- 1349US10504823B2Power semiconductor device with small contact footprint and the preparation methodALPHA & OMEGA SEMICONDUCTOR CAYMAN LTD·Filed 2017·Granted Dec 10, 2019·0 cites·13 claims
- 1448US5931701AElectrical connector assemblyHON HAI PREC IND CO LTD·Filed 1997·Granted Aug 3, 1999·16 cites·4 claims
- 1547US9685430B2Embedded package and method thereofALPHA & OMEGA SEMICONDUCTOR·Filed 2015·Granted Jun 20, 2017·0 cites·4 claims
- 1646US5971802AElectrical connector with board retention meansHON HAI PREC IND CO LTD·Filed 1997·Granted Oct 26, 1999·12 cites·6 claims
- 1745US8039946B2Chip package structure and fabricating method thereofCHIPMOS TECHNOLOGIES SHANGHAI LTD·Filed 2009·Granted Oct 18, 2011·0 cites·10 claims
- 1845US2022340782A1Ultra-quiet backing-paper-free cold laminating film and preparation method thereofZHEJIANG FULAI NEW MAT CO LTD·Filed 2019·Application pending·0 cites
- 1943US6002092AKeyswitch key apparatusFiled 1998·Granted Dec 14, 1999·8 cites·4 claims
- 2041US2014175628A1Copper wire bonding structure in semiconductor device and fabrication method thereofPAN HUA·Filed 2012·Application pending·0 cites
- 2140US2008012106A1Chip package structure and fabricating method threrofCHIPMOS TECHNOLOGIES SHANGHAI·Filed 2006·Application pending·0 cites
- 2238US6127640AKeyswitch assemblyHON HAI PREC IND CO LTD·Filed 1998·Granted Oct 3, 2000·6 cites·6 claims
- 2334US5795184ADevice for interconnecting stacked connectors and boardHON HAI PREC IND CO LTD·Filed 1996·Granted Aug 18, 1998·5 cites·13 claims
- 2433US8703545B2Aluminum alloy lead-frame and its use in fabrication of power semiconductor packageNIU ZHIQIANG·Filed 2012·Granted Apr 22, 2014·0 cites·25 claims
- 2532US6066818AKeyboard assembly having heat dissipating deviceHON HAI PREC IND CO LTD·Filed 1998·Granted May 23, 2000·2 cites·6 claims
- 2632US5980274AConnector housing with spacers between contact pinsHON HAI PREC IND CO LTD·Filed 1997·Granted Nov 9, 1999·3 cites·4 claims
- 2729US6022232AZIF card edge connectorHON HAI PREC IND CO LTD·Filed 1998·Granted Feb 8, 2000·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →