Inventor · disambiguated record
Huang-Wen Tseng
Also filed as: TSENG HUANG-WEN
25 granted patents·7 pending applications·35 citations·filing 2011–2024
93Inventor score
Top patents by PatentIndex Score
32 records- 0194US10937858B2Method for manufacturing semiconductor and structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 2, 2021·3 cites·20 claims
- 0292US11804433B2Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 31, 2023·2 cites·20 claims
- 0392US11626343B2Semiconductor device with enhanced thermal dissipation and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 11, 2023·6 cites·20 claims
- 0490US11672181B2Magnetic random access memoryTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 6, 2023·2 cites·20 claims
- 0590US11088037B2Semiconductor device having probe pads and seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·6 cites·20 claims
- 0689US10784440B2Magnetic random access memory with various size magnetic tunneling junction film stacksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 22, 2020·8 cites·19 claims
- 0787US11038098B2Magnetic random access memory with various size magnetic tunneling junction film stacksTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 15, 2021·2 cites·20 claims
- 0885US11721597B2Semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 8, 2023·1 cites·20 claims
- 0981US10347548B2Integrated circuit package structure and testing method using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 9, 2019·3 cites·20 claims
- 1080US2025087553A1Semiconductor device with enhanced thermal dissipation and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1178US2024312851A1Semiconductor package and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1277US11993512B2Dual micro-electro mechanical system and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 1375US12183655B2Semiconductor device with enhanced thermal dissipation and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 1475US12027433B2Semiconductor package and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 1575US11417670B2Structure and method for single gate non-volatile memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 16, 2022·1 cites·20 claims
- 1674US11908884B2Inductive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·13 claims
- 1773US11274037B2Dual micro-electro mechanical system and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 15, 2022·0 cites·20 claims
- 1873US2023387182A1Inductive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1973US2022367494A1Structure and Method for Single Gate Non-Volatile Memory DeviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2071US2024047310A1Semiconductor package structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2170US11776919B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 2269US11482461B2Semiconductor package and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·20 claims
- 2369US10153290B2Structure and method for single gate non-volatile memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 11, 2018·1 cites·15 claims
- 2468US11322576B2Inductive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 2566US11854913B2Method for detecting defects in semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 2661US11450626B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
- 2760US10629673B2Method for manufacturing semiconductor and structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 21, 2020·0 cites·20 claims
- 2857US10699977B2Method of detecting delamination in an integrated circuit package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 30, 2020·0 cites·20 claims
- 2955US2022376034A1Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 3054US11837526B2Semiconductor package structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 5, 2023·0 cites·20 claims
- 3149US10937772B2Semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 2, 2021·0 cites·20 claims
- 3248US2013020623A1Structure and method for single gate non-volatile memory deviceTAIWAN SEMICONDUCTOR MFG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →