Inventor · disambiguated record
Huailiang Wei
Also filed as: WEI HUAILIANG
12 granted patents·2 pending applications·117 citations·filing 1999–2016
90Inventor score
Top patents by PatentIndex Score
14 records- 0197US9349669B2Reduced stress TSV and interposer structuresINVENSAS CORP·Filed 2015·Granted May 24, 2016·23 cites·25 claims
- 0297US9000600B2Reduced stress TSV and interposer structuresINVENSAS CORP·Filed 2014·Granted Apr 7, 2015·28 cites·15 claims
- 0389US6363746B1Method and apparatus for making multi-component glass sootCORNING INC·Filed 2000·Granted Apr 2, 2002·19 cites·31 claims
- 0485US9508687B2Low cost hybrid high density packageTESSERA INC·Filed 2015·Granted Nov 29, 2016·4 cites·16 claims
- 0585US8772946B2Reduced stress TSV and interposer structuresUZOH CYPRIAN EMEKA·Filed 2012·Granted Jul 8, 2014·6 cites·83 claims
- 0678US8963310B2Low cost hybrid high density packageDESAI Kishor·Filed 2011·Granted Feb 24, 2015·5 cites·16 claims
- 0775US6374642B1Method and apparatus for combustion-enhanced vaporizationCORNING INC·Filed 2000·Granted Apr 23, 2002·8 cites·30 claims
- 0857US6724964B2Optical waveguide exhibiting strongly positive dispersion, and system utilizing sameLASERCOMM INC·Filed 2002·Granted Apr 20, 2004·7 cites·20 claims
- 0957US6385384B1Glasses containing rare earth fluoridesCORNING INC·Filed 1999·Granted May 7, 2002·17 cites·30 claims
- 1055US9875955B2Low cost hybrid high density packageTESSERA INC·Filed 2016·Granted Jan 23, 2018·0 cites·15 claims
- 1144US6401494B2Method for making glasses containing rare earth fluorides by precipitating solution doped compoundsCORNING INC·Filed 2001·Granted Jun 11, 2002·0 cites·14 claims
- 1244US2004118155A1Method of making ultra-dry, Cl-free and F-doped high purity fused silicaBROWN JOHN T·Filed 2002·Application pending·0 cites
- 1337US2003099450A1Profile for limited mode fiberFiled 2002·Application pending·0 cites
- 1436US8525312B2Area array quad flat no-lead (QFN) packageLOW QWAI H·Filed 2011·Granted Sep 3, 2013·0 cites·26 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →