Inventor · disambiguated record
Huanbo Zhang
Also filed as: ZHANG HUANBO
17 granted patents·15 pending applications·91 citations·filing 2002–2025
93Inventor score
Top patents by PatentIndex Score
32 records- 0195US11931853B2Control of processing parameters for substrate polishing with angularly distributed zones using cost functionAPPLIED MATERIALS INC·Filed 2022·Granted Mar 19, 2024·2 cites·19 claims
- 0295US10022837B2Inner retaining ring and outer retaining ring for carrier headAPPLIED MATERIALS INC·Filed 2015·Granted Jul 17, 2018·6 cites·7 claims
- 0395US8721391B2Carrier head with narrow inner ring and wide outer ringCHEN HUNG CHIH·Filed 2011·Granted May 13, 2014·13 cites·17 claims
- 0494US10493590B2Selection of polishing parameters to generate removal or pressure profileAPPLIED MATERIALS INC·Filed 2015·Granted Dec 3, 2019·8 cites·22 claims
- 0591US11400560B2Retaining ring designAPPLIED MATERIALS INC·Filed 2018·Granted Aug 2, 2022·6 cites·20 claims
- 0690US9213340B2Selection of polishing parameters to generate removal or pressure profileAPPLIED MATERIALS INC·Filed 2014·Granted Dec 15, 2015·11 cites·21 claims
- 0788US8840446B2Inner retaining ring and outer retaining ring for carrier headAPPLIED MATERIALS INC·Filed 2013·Granted Sep 23, 2014·5 cites·16 claims
- 0887US8774958B2Selection of polishing parameters to generate removal profileZHANG HUANBO·Filed 2011·Granted Jul 8, 2014·15 cites·21 claims
- 0984US11173579B2Inner retaining ring and outer retaining ring for carrier headAPPLIED MATERIALS INC·Filed 2018·Granted Nov 16, 2021·1 cites·12 claims
- 1084US10322492B2Retaining ring for CMPAPPLIED MATERIALS INC·Filed 2017·Granted Jun 18, 2019·3 cites·18 claims
- 1184US2025319568A1Control of processing parameters for substrate polishing with substrate precessionAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1275US11282755B2Asymmetry correction via oriented wafer loadingAPPLIED MATERIALS INC·Filed 2019·Granted Mar 22, 2022·1 cites·14 claims
- 1375US2024087965A1Asymmetry correction via oriented wafer loadingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1473US12343840B2Control of processing parameters for substrate polishing with substrate precessionAPPLIED MATERIALS INC·Filed 2022·Granted Jul 1, 2025·0 cites·17 claims
- 1573US6811470B2Methods and compositions for chemical mechanical polishing shallow trench isolation substratesAPPLIED MATERIALS INC·Filed 2002·Granted Nov 2, 2004·20 cites·58 claims
- 1672US11869815B2Asymmetry correction via oriented wafer loadingAPPLIED MATERIALS INC·Filed 2022·Granted Jan 9, 2024·0 cites·13 claims
- 1770US2024253183A1Apparatus and method for controlling substrate polish edge uniformityAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1869US2025114896A1Individually rotatable platens and control of carrier head sweepAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1969US2025108473A1Polishing head with decoupled membrane position controlAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2069US2025108479A1Polishing head with flexure extending through pressure chamberAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2169US2025114899A1Cmp with individually rotatable platensAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2269US2025108477A1Chemical mechanical polishing edge control with pad recessesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2368US2025114901A1Grooves for edge and hot spot compensation in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2468US2025114898A1Retaining ring for edge compensation by slurry flow controlAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2568US2025114897A1Edge and hot spot compensation techniques in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2667US2024139906A1Control of carrier head sweep and platen shapeAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 2767US2022339755A1Retaining ring designAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2864US11241769B2Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processesAPPLIED MATERIALS INC·Filed 2018·Granted Feb 8, 2022·0 cites·15 claims
- 2960US11673226B2Retaining ring for CMPAPPLIED MATERIALS INC·Filed 2019·Granted Jun 13, 2023·0 cites·20 claims
- 3060US2024033878A1Minimizing substrate bow during polishingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3158US10252397B2Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processesAPPLIED MATERIALS INC·Filed 2015·Granted Apr 9, 2019·0 cites·9 claims
- 3252US2023356355A1Polishing head with local inner ring downforce controlAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →