Inventor · disambiguated record
Hwa-Il Jin
Also filed as: JIN HWA IL
4 granted patents·21 citations·filing 2000–2020
66Inventor score
Top patents by PatentIndex Score
4 records- 0174US6312801B1Adhesive tape for electronic partsSAEHAN IND INC·Filed 2000·Granted Nov 6, 2001·20 cites·5 claims
- 0266US10879225B2Semiconductor package and method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Dec 29, 2020·1 cites·22 claims
- 0359US11205637B2Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 21, 2021·0 cites·20 claims
- 0453US10797021B2Semiconductor packages having improved thermal discharge and electromagnetic shielding characteristicsSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 6, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →