Inventor · disambiguated record
Hyo-Jae Bang
Also filed as: BANG HYO-JAE
25 granted patents·10 pending applications·128 citations·filing 2005–2016
95Inventor score
Top patents by PatentIndex Score
35 records- 0194US8982567B2Device including circuit board with different form factor terminal sets and assemblies including the sameBANG HYO-JAE·Filed 2012·Granted Mar 17, 2015·24 cites·19 claims
- 0283US8240360B2Fin-type heat sink for electronic componentBANG HYO-JAE·Filed 2008·Granted Aug 14, 2012·12 cites·18 claims
- 0380US7791178B2Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Sep 7, 2010·9 cites·20 claims
- 0479US8339794B2Super capacitor casing and supercapacitor embedded deviceBANG HYO-JAE·Filed 2010·Granted Dec 25, 2012·4 cites·31 claims
- 0577US8934255B2Super capacitor casing and supercapacitor embedded deviceSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Jan 13, 2015·4 cites·13 claims
- 0677US8189342B2Printed circuit board for memory module, method of manufacturing the same and memory module/socket assemblyBANG HYO-JAE·Filed 2006·Granted May 29, 2012·8 cites·10 claims
- 0777US7521788B2Semiconductor module with conductive element between chip packagesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 21, 2009·8 cites·30 claims
- 0876US7715200B2Stacked semiconductor module, method of fabricating the same, and electronic system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 11, 2010·7 cites·18 claims
- 0970US8385079B2Pressure conductive sheetSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Feb 26, 2013·4 cites·14 claims
- 1070US8218330B2Reworkable passive element embedded printed circuit boardBANG HYO-JAE·Filed 2007·Granted Jul 10, 2012·4 cites·15 claims
- 1166US7900349B2Method of fabricating an electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 8, 2011·3 cites·17 claims
- 1265US7576437B2Printed circuit board of semiconductor package and method for mounting semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 18, 2009·3 cites·16 claims
- 1364US7663219B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 16, 2010·2 cites·7 claims
- 1463US7902664B2Semiconductor package having passive component and semiconductor memory module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Mar 8, 2011·3 cites·12 claims
- 1560US7906423B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Mar 15, 2011·1 cites·7 claims
- 1659USD794644SMemory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 15, 2017·8 cites·1 claims
- 1753USD795262SMemory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 22, 2017·6 cites·1 claims
- 1850USD794643SMemory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 15, 2017·5 cites·1 claims
- 1949US7990734B2Semiconductor memory module with reverse mounted chip resistorSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Aug 2, 2011·0 cites·20 claims
- 2048US7968994B2Memory modules and systems including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jun 28, 2011·0 cites·14 claims
- 2147US2008042279A1Mounting structure of semiconductor device having flux and under fill resin layer and method of mounting semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2246USD795261SMemory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 22, 2017·4 cites·1 claims
- 2346US9208068B2Data storage devices including multiple host interfaces and user devices including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Dec 8, 2015·0 cites·20 claims
- 2446US2007181993A1Printed circuit board including reinforced copper plated film and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2546US2007072467A1Method of testing a substrate and apparatus for performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2646US2008164054A1Printed circuit board capable of void control during surface mounting processSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2745US2008136580A1Chip network resistor contacting pcb through solder balls and semiconductor module having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2843US2009016022A1Semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2942USD794641SMemory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 15, 2017·3 cites·1 claims
- 3042USD794642SMemory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 15, 2017·3 cites·1 claims
- 3142USD794034SMemory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Aug 8, 2017·3 cites·1 claims
- 3242US2011256671A1Semiconductor memory module with reverse mounted chip resistorCHOI HYUN-SEOK·Filed 2011·Application pending·0 cites
- 3342US2008044951A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3442US2008079128A1Lead frame type stack package and method o fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 3539US2006043578A1Semiconductor device having heat sinkBANG HYO-JAE·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hyo-Jae Bang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →