Inventor · disambiguated record
Hyunsoo Chung
Also filed as: CHUNG HYUNSOO
37 granted patents·56 pending applications·168 citations·filing 2010–2025
96Inventor score
Top patents by PatentIndex Score
93 records- 0197US10211070B2Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Feb 19, 2019·51 cites·18 claims
- 0294US9853012B2Semiconductor packages having through electrodes and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Dec 26, 2017·12 cites·9 claims
- 0393US9508704B2Method of fabricating semiconductor package, semiconductor package formed thereby, and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 29, 2016·11 cites·14 claims
- 0491US10188961B1Assembly unit for toy assembly blockCREAMO INC·Filed 2018·Granted Jan 29, 2019·13 cites·7 claims
- 0591US9165916B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 20, 2015·14 cites·13 claims
- 0690US11923292B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 5, 2024·2 cites·17 claims
- 0789US9287140B2Semiconductor packages having through electrodes and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Mar 15, 2016·9 cites·19 claims
- 0888US8927426B2Semiconductor devices having through-vias and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 6, 2015·10 cites·14 claims
- 0987US8941216B2Semiconductor devices having through-vias and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 27, 2015·7 cites·7 claims
- 1086US11362054B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 14, 2022·2 cites·19 claims
- 1186US9245771B2Semiconductor packages having through electrodes and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 26, 2016·8 cites·30 claims
- 1283US11296004B2Semiconductor package including heat redistribution layersSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Apr 5, 2022·4 cites·12 claims
- 1383US9171753B2Semiconductor devices having conductive via structures and methods for fabricating the sameLEE HO-JIN·Filed 2013·Granted Oct 27, 2015·7 cites·19 claims
- 1480US10699915B2Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 30, 2020·2 cites·20 claims
- 1578US11705418B2Semiconductor package with conductive bump on conductive post including an intermetallic compound layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 18, 2023·1 cites·20 claims
- 1678US9153489B2Microelectronic devices having conductive through via electrodes insulated by gap regionsLEE HO-JIN·Filed 2012·Granted Oct 6, 2015·5 cites·20 claims
- 1777US12388024B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 1877US8564139B2Semiconductor devices including protected barrier layersLEE HO-JIN·Filed 2012·Granted Oct 22, 2013·4 cites·18 claims
- 1974US2025105217A1Semiconductor package, and a package on package type semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2074US2025054915A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2173US9859204B2Semiconductor devices with redistribution padsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 2, 2018·2 cites·18 claims
- 2271US11574819B2Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 7, 2023·0 cites·20 claims
- 2369US10937667B2Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 2, 2021·0 cites·20 claims
- 2469US9204785B2Endoscope sheath, endoscope arrangement, and method for providing an endoscope arrangementSTORZ KARL GMBH & CO KG·Filed 2013·Granted Dec 8, 2015·4 cites·1 claims
- 2566US12009328B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jun 11, 2024·0 cites·20 claims
- 2665US12033948B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jul 9, 2024·0 cites·20 claims
- 2764US12159858B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 3, 2024·0 cites·16 claims
- 2864US2025349812A1Semiconductor package and manufacturing method of the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2963US12512446B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·19 claims
- 3063US12166013B2Semiconductor package, and a package on package type semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 10, 2024·0 cites·20 claims
- 3163US2025253297A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3263US2025266398A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3363US2025300031A1Package substrate, semiconductor package including package substrate and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3463US2025391813A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3563US2025183241A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3663US2025253279A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3763US2025239576A1Optical controller package and optoelectronic memory module including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3862US2025192085A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3962US2025240977A1High bandwidth memorySAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4062US2025192109A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4162US2025226366A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4261US2025096214A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4361US2025087570A1Semiconductor package and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4461US2025096215A1Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4561US2025054913A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4661US2020346128A1Assembly unit for toy assembly blockCREAMO INC·Filed 2020·Application pending·0 cites
- 4760US2025015048A1Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4860US2025062237A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 4960US2025046749A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 5060US2025183243A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 93 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →