Inventor · disambiguated record
Hyungjun Hur
Also filed as: HUR HYUNGJUN
4 granted patents·1 pending application·9 citations·filing 2018–2023
70Inventor score
Files withLAM RES CORP5
Top patents by PatentIndex Score
5 records- 0194US11401623B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2021·Granted Aug 2, 2022·3 cites·26 claims
- 0293US11859300B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2022·Granted Jan 2, 2024·2 cites·18 claims
- 0387US10927475B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2018·Granted Feb 23, 2021·4 cites·16 claims
- 0481US12392049B2Controlling plating electrolyte concentration on an electrochemical plating apparatusLAM RES CORP·Filed 2023·Granted Aug 19, 2025·0 cites·19 claims
- 0546US2023260837A1Methods to improve wafer wettability for plating - enhancement through sensors and control algorithmsLAM RES CORP·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →