Inventor · disambiguated record
Hyunsu Hwang
Also filed as: HWANG HYUNSU
14 granted patents·15 pending applications·1 citations·filing 2016–2025
83Inventor score
Top patents by PatentIndex Score
29 records- 0182US2025343146A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0281US11798872B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 24, 2023·1 cites·20 claims
- 0378US2025015009A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0476US12381151B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 5, 2025·0 cites·20 claims
- 0576US12119306B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 15, 2024·0 cites·20 claims
- 0672US2024321794A1Semiconductor chip having a through electrode and semiconductor package including the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0771US2024290702A1Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0870US12347760B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jul 1, 2025·0 cites·19 claims
- 0969US11682630B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·20 claims
- 1068US12027482B2Semiconductor chip having a through electrode and semiconductor package including the semiconductor chipSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·19 claims
- 1167US11664312B2Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·0 cites·19 claims
- 1264US2025275122A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1363US12451474B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 21, 2025·0 cites·19 claims
- 1463US11923309B2Semiconductor package including fine redistribution patternsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 1563US2025349735A1Semiconductor device and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1662US12009288B2Interconnection structure and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 11, 2024·0 cites·19 claims
- 1759US11854893B2Method of manufacturing semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1859US2025125290A1Device for semiconductor package comprising connecting strucure and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1959US2024234103A1Ring assembly and semiconductor wafer etching deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2058US2025029941A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2157US12224256B2Wafer structure and semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 11, 2025·0 cites·20 claims
- 2256US2024237349A1Three-dimensional semiconductor memory device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2355US2024128239A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2455US2024162104A1Semiconductor device, semiconductor package, and semiconductor chip manufacturing methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2555US2023420397A1Semiconductor chip and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2654US2024145366A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2753US12456627B2Dry etching apparatus and wafer etching system using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 28, 2025·0 cites·20 claims
- 2849US2023089399A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2927US11109337B2Method for estimating arrival time of wireless communication signal and computer-readable recording medium recording sameVILLIV MICRON INC·Filed 2016·Granted Aug 31, 2021·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →