Inventor · disambiguated record
Hyung-Sun Jang
Also filed as: JANG HYUNG-SUN
21 granted patents·9 pending applications·108 citations·filing 2007–2024
93Inventor score
Top patents by PatentIndex Score
30 records- 0195US7948555B2Camera module and electronic apparatus having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 24, 2011·32 cites·17 claims
- 0289US7786581B2Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related deviceSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 31, 2010·16 cites·10 claims
- 0388US7619315B2Stack type semiconductor chip package having different type of chips and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Nov 17, 2009·14 cites·11 claims
- 0486US11107783B2Wafer-level package including under bump metal layerSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Aug 31, 2021·4 cites·18 claims
- 0585US7893514B2Image sensor package, method of manufacturing the same, and image sensor module including the image sensor packageSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Feb 22, 2011·14 cites·13 claims
- 0682US11810878B2Wafer-level package including under bump metal layerSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 7, 2023·1 cites·14 claims
- 0781US10647316B2Apparatus and method for deciding a maneuver of a nearby vehicleHYUNDAI MOTOR CO LTD·Filed 2018·Granted May 12, 2020·5 cites·20 claims
- 0878US8125042B2Semiconductor package and method of manufacturing the sameKIM JUNG-HWAN·Filed 2009·Granted Feb 28, 2012·10 cites·21 claims
- 0972US8558371B2Method for wafer level package and semiconductor device fabricated using the sameHONG JISUN·Filed 2011·Granted Oct 15, 2013·5 cites·16 claims
- 1069US11862589B2Wafer-level package including under bump metal layerSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 2, 2024·0 cites·19 claims
- 1165US8114701B2Camera modules and methods of fabricating the sameKWON WOON-SEONG·Filed 2008·Granted Feb 14, 2012·3 cites·20 claims
- 1261US11255285B2Vehicle and method of controlling engine start for the sameHYUNDAI MOTOR CO LTD·Filed 2020·Granted Feb 22, 2022·0 cites·19 claims
- 1360US2025357403A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1458US8563349B2Method of forming semiconductor deviceMYUNG JONG-YUN·Filed 2011·Granted Oct 22, 2013·2 cites·5 claims
- 1557US7884392B2Image sensor having through viaLEE HYUEK-JAE·Filed 2009·Granted Feb 8, 2011·2 cites·20 claims
- 1654US8852988B2Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 7, 2014·0 cites·12 claims
- 1752US2010019338A1Stack type semiconductor chip package having different type of chips and fabrication method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 1849US11789141B2Omnidirectional sensor fusion system and method and vehicle including the sameHYUNDAI MOTOR CO LTD·Filed 2019·Granted Oct 17, 2023·0 cites·20 claims
- 1949US11287525B2Apparatus and method for identifying short cut-in vehicle and vehicle using the sameHYUNDAI MOTOR CO LTD·Filed 2019·Granted Mar 29, 2022·0 cites·20 claims
- 2049US2008012084A1Image sensor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2148US11307292B2ODM information reliability determination system and method and vehicle using the sameHYUNDAI MOTOR CO LTD·Filed 2019·Granted Apr 19, 2022·0 cites·17 claims
- 2247US2009256931A1Camera module, method of manufacturing the same, and electronic system having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 2345US2008284041A1Semiconductor package with through silicon via and related method of fabricationSAMSUNG ELECTRONICS CO LTD·Filed 2008·Application pending·0 cites
- 2445US2010320500A1Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating and related deviceSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 2544US2008054456A1Semiconductor package including silver bump and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2644US2008055438A1Image sensor package, related method of manufacture and image sensor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
- 2742US8466527B2Semiconductor package and method of manufacturing the sameJANG HYUNG-SUN·Filed 2010·Granted Jun 18, 2013·0 cites·17 claims
- 2837US8304288B2Methods of packaging semiconductor devices including bridge patternsLEE HYUEK-JAE·Filed 2011·Granted Nov 6, 2012·0 cites·20 claims
- 2936US11328516B2Apparatus and method for associating sensor data in vehicleHYUNDAI MOTOR CO LTD·Filed 2018·Granted May 10, 2022·0 cites·15 claims
- 3036US2017110440A1Semiconductor package and method for manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →