Inventor · disambiguated record
Hyeon-Woo Jang
Also filed as: JANG HYEON WOO
24 granted patents·11 pending applications·75 citations·filing 2008–2025
94Inventor score
Files withSAMSUNG ELECTRONICS CO LTD24LG ENERGY SOLUTION LTD3JANG HYEON-WOO2RYU HO-IN2BANG JUNG-SIK1
Top patents by PatentIndex Score
35 records- 0197US12016176B2Semiconductor memory device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 18, 2024·3 cites·19 claims
- 0297US11723191B2Semiconductor memory devices having protruding contact portionsSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 8, 2023·8 cites·20 claims
- 0392US9177891B2Semiconductor device including contact padsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 3, 2015·12 cites·14 claims
- 0491US9607994B2Methods of fabricating semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 28, 2017·8 cites·19 claims
- 0591US9099343B2Semiconductor devicesKIM KEUNNAM·Filed 2013·Granted Aug 4, 2015·14 cites·20 claims
- 0690US12401093B2Assembly manufacturing equipment and method for electrode assemblyLG ENERGY SOLUTION LTD·Filed 2024·Granted Aug 26, 2025·0 cites·30 claims
- 0790US9184168B2Semiconductor devices with peripheral gate structuresRYU HO-IN·Filed 2013·Granted Nov 10, 2015·14 cites·14 claims
- 0889US10714478B2Semiconductor devices with peripheral gate structuresSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 14, 2020·5 cites·26 claims
- 0983US12388156B2Assembly manufacturing equipment and method for electrode assemblyLG ENERGY SOLUTION LTD·Filed 2022·Granted Aug 12, 2025·0 cites·17 claims
- 1079US12279415B2Method of fabricating semiconductor memory device having protruding contact portionSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·20 claims
- 1179US8878293B2Semiconductor device having DC structureSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 4, 2014·5 cites·20 claims
- 1279US2024306380A1Semiconductor memory device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1379US2025203847A1Semiconductor memory devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1477US9472617B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 18, 2016·3 cites·20 claims
- 1574US12464709B2Semiconductor memory device with buried contacts and a fenceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Nov 4, 2025·0 cites·19 claims
- 1669US11948882B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Apr 2, 2024·0 cites·20 claims
- 1769US2025261363A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1867US11502082B2Semiconductor devices with peripheral gate structuresSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 15, 2022·0 cites·19 claims
- 1966US2023369691A1Pouch Bag for Secondary Battery and Pouch Type Secondary Battery Comprising SameLG ENERGY SOLUTION LTD·Filed 2022·Application pending·0 cites
- 2065US11832442B2Semiconductor memory device with buried contacts and a fenceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·18 claims
- 2165US10056339B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Aug 21, 2018·1 cites·20 claims
- 2264US11495533B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 8, 2022·0 cites·20 claims
- 2363US12302556B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted May 13, 2025·0 cites·15 claims
- 2463US2025374519A1Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2558US2025142813A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2656US2023189504A1Semiconductor memory deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 2752US9966495B2Transparent conductive layer and transparent electrode comprising the sameLG CHEMICAL LTD·Filed 2014·Granted May 8, 2018·0 cites·3 claims
- 2852US8507999B2Semiconductor device, method of fabricating the same, and semiconductor module and electronic system including the semiconductor deviceJANG HYEON-WOO·Filed 2011·Granted Aug 13, 2013·1 cites·19 claims
- 2952US8303856B2Conductive laminated body and method for preparing the sameJANG HYEON WOO·Filed 2008·Granted Nov 6, 2012·1 cites·16 claims
- 3052US2023146012A1Semiconductor memory device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
- 3151US9536868B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 3, 2017·0 cites·20 claims
- 3250US2011174361A1Transparent conductive layer and transparent electrode comprising the sameBANG JUNG-SIK·Filed 2009·Application pending·0 cites
- 3349US2016056158A1Methods of manufacturing semiconductor devicesRYU HO-IN·Filed 2015·Application pending·0 cites
- 3446US8920912B2Multilayer structured transparent electrically-conductive film and method of manufacturing the sameRYU SANG UK·Filed 2011·Granted Dec 30, 2014·0 cites·15 claims
- 3546US2023045674A1Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →