Inventor · disambiguated record
Hyeong-Seob Kim
Also filed as: KIM HYEONG-SEOB
13 granted patents·3 pending applications·654 citations·filing 1996–2023
92Inventor score
Technology areasH10W
Top patents by PatentIndex Score
16 records- 0197US6448661B1Three-dimensional multi-chip package having chip selection pads and manufacturing method thereofSAMSUNG ELECTORNICS CO LTD·Filed 2002·Granted Sep 10, 2002·420 cites·14 claims
- 0296US6982487B2Wafer level package and multi-package stackSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Jan 3, 2006·145 cites·35 claims
- 0392US8901750B2Semiconductor package including multiple chips and separate groups of leadsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Dec 2, 2014·12 cites·20 claims
- 0490US11626373B2Semiconductor packages including antenna patternSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 11, 2023·2 cites·20 claims
- 0590US7335592B2Wafer level package, multi-package stack, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Feb 26, 2008·20 cites·9 claims
- 0685US8592997B2Molded underfill flip chip package preventing warpage and voidYU HAE-JUNG·Filed 2010·Granted Nov 26, 2013·12 cites·20 claims
- 0777US7105919B2Semiconductor package having ultra-thin thickness and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Sep 12, 2006·24 cites·27 claims
- 0873US12261135B2Semiconductor packages including antenna patternSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 0963US7420129B2Semiconductor package including a semiconductor device, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Sep 2, 2008·3 cites·21 claims
- 1057US9455217B2Semiconductor package including multiple chips and separate groups of leadsSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 27, 2016·0 cites·20 claims
- 1148US5898226ASemiconductor chip having a bonding window smaller than a wire ballSAMSUNG ELECTRONICS CO LTD·Filed 1996·Granted Apr 27, 1999·16 cites·11 claims
- 1247US8129826B2Semiconductor package apparatus having redistribution layerPARK SANG-WOOK·Filed 2009·Granted Mar 6, 2012·0 cites·22 claims
- 1345US2006249823A1Semiconductor package having ultra-thin thickness and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1441US2013277831A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 1541US2013082368A1Emi shielded semiconductor package and emi shielded substrate moduleSAMSUNG ELECTRONICS CO LTD·Filed 2012·Application pending·0 cites
- 1638US8026616B2Printed circuit board, semiconductor package, card apparatus, and systemSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Sep 27, 2011·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →