Inventor · disambiguated record
Hyungjoon Kwon
Also filed as: KWON HYUNGJOON
10 granted patents·1 pending application·33 citations·filing 2013–2017
85Inventor score
Top patents by PatentIndex Score
11 records- 0195US9496488B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 15, 2016·15 cites·21 claims
- 0287US9570670B2Magnetic device and method of fabricating the samePARK CHANJIN·Filed 2013·Granted Feb 14, 2017·10 cites·23 claims
- 0383US9685606B2Patterning methods, methods of fabricating semiconductor devices using the same, and semiconductor devices fabricated therebySAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jun 20, 2017·3 cites·19 claims
- 0477US9627610B2Method of forming a pattern using ion beams of bilateral symmetry, a method of forming a magnetic memory device using the same, and an ion beam apparatus generating ion beams of bilateral symmetryPARK JONGCHUL·Filed 2015·Granted Apr 18, 2017·2 cites·19 claims
- 0568US10038136B2Semiconductor devices and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jul 31, 2018·1 cites·2 claims
- 0665US9142757B2Magnetic memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 22, 2015·1 cites·20 claims
- 0757US9525128B2Semiconductor devices and methods of manufacturing the sameCHUNG SUNGYOON·Filed 2014·Granted Dec 20, 2016·1 cites·18 claims
- 0856US9859492B2Magnetic memory devices having sloped electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jan 2, 2018·0 cites·8 claims
- 0950US9871194B2Ion beam apparatus generating ion beams of bilateral symmetryPARK JONGCHUL·Filed 2017·Granted Jan 16, 2018·0 cites·19 claims
- 1049US9978932B2Semiconductor devices and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 22, 2018·0 cites·17 claims
- 1141US2014024138A1Method for etching metal layer and method for manufacturing a semiconductor device using the sameKWON HYUNGJOON·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →