Inventor · disambiguated record
Hye In Lee
Also filed as: LEE HYE IN
13 granted patents·9 pending applications·3 citations·filing 2016–2022
82Inventor score
Top patents by PatentIndex Score
22 records- 0180US10430940B2Inspection system and inspection methodKOH YOUNG TECH INC·Filed 2016·Granted Oct 1, 2019·2 cites·11 claims
- 0260US10672116B2Substrate inspection method and systemKOH YOUNG TECH INC·Filed 2016·Granted Jun 2, 2020·1 cites·20 claims
- 0360US2025360565A1Data-based system for optimizing powder bed fusion additive manufacturing processKOREA ELECTRONICS TECHNOLOGY·Filed 2022·Application pending·0 cites
- 0458US11798231B2Method for generating hollow structure based on 2D laminated cross-sectional outline for 3D printingKOREA ELECTRONICS TECHNOLOGY·Filed 2020·Granted Oct 24, 2023·0 cites·20 claims
- 0558US10796428B2Inspection system and inspection methodKOH YOUNG TECH INC·Filed 2019·Granted Oct 6, 2020·0 cites·13 claims
- 0658US2024253124A1Thermal-analysis-based output stabilization method and system for improving 3d printing output reliabilityKOREA ELECTRONICS TECHNOLOGY·Filed 2022·Application pending·0 cites
- 0757US12350886B23D printing slicing method for solving quantization error problemKOREA ELECTRONICS TECHNOLOGY·Filed 2020·Granted Jul 8, 2025·0 cites·13 claims
- 0857US2025045484A1Support sink application method for 3d printing heat dissipation analysisKOREA ELECTRONICS TECHNOLOGY·Filed 2022·Application pending·0 cites
- 0957US2024232783A1Method and system for providing domain-specific process frameworkKOREA ELECTRONICS TECHNOLOGY·Filed 2022·Application pending·0 cites
- 1056US12220921B2Nozzle clogging defect compensating method for binder jetting stack manufacturing meansKOREA ELECTRONICS TECHNOLOGY·Filed 2020·Granted Feb 11, 2025·0 cites·18 claims
- 1156US12202206B23D printing slicing method for solving tolerance problemKOREA ELECTRONICS TECHNOLOGY·Filed 2021·Granted Jan 21, 2025·0 cites·20 claims
- 1254US2023249257A1Tool path optimization method for minimizing thermal unbalance in metal 3d printingKOREA ELECTRONICS TECHNOLOGY·Filed 2021·Application pending·0 cites
- 1353US11613082B2Method for producing 3D mesh surface characteristic-based support for laminate manufacturingKOREA ELECTRONICS TECHNOLOGY·Filed 2020·Granted Mar 28, 2023·0 cites·18 claims
- 1452US12400412B2Method for modifying design on basis of additive cross-section outline for 3D printingKOREA ELECTRONICS TECHNOLOGY·Filed 2021·Granted Aug 26, 2025·0 cites·16 claims
- 1552US11836425B2Engineering change orders with consideration of adversely affected constraintsSYNOPSYS INC·Filed 2021·Granted Dec 5, 2023·0 cites·20 claims
- 1652US2023415422A1Method for generating auxiliary support for 3d printing output stabilityKOREA ELECTRONICS TECHNOLOGY·Filed 2021·Application pending·0 cites
- 1752US2024100779A1Method for regenerating tool path on basis of output data feedback in order to improve 3d printing output reliabilityKOREA ELECTRONICS TECHNOLOGY·Filed 2021·Application pending·0 cites
- 1851US11548227B2Method for monitoring 3D printing equipped with 3D printing slicer and recursive loop structureKOREA ELECTRONICS TECHNOLOGY·Filed 2018·Granted Jan 10, 2023·0 cites·10 claims
- 1947US2024256729A1Method and system for determining model output direction on basis of heat dissipation characteristic analysis for stabilizing output of metal 3d printingKOREA ELECTRONICS TECHNOLOGY·Filed 2022·Application pending·0 cites
- 2046US10650510B2Substrate inspection apparatus and methodKOH YOUNG TECH INC·Filed 2016·Granted May 12, 2020·0 cites·11 claims
- 2145US12233601B2Method for creating 2D slicing polyline based support structure for 3D printingKOREA ELECTRONICS TECHNOLOGY·Filed 2019·Granted Feb 25, 2025·0 cites·16 claims
- 2244US2022410485A1Slicing 2d data-based pattern application method for reducing binder usage amount in sand binder jettingKOREA ELECTRONICS TECHNOLOGY·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →