Inventor · disambiguated record
Hyung-Woo Nam
Also filed as: NAM HYUNG-WOO
5 granted patents·3 pending applications·195 citations·filing 2001–2005
83Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
8 records- 0196US6653210B2Method and apparatus for cutting a non-metallic substrate using a laser beamSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Nov 25, 2003·134 cites·7 claims
- 0284US6541730B2Method and apparatus for cutting a non-metal substrate by using a laser beamSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 1, 2003·31 cites·31 claims
- 0379US7542125B2Method for cutting an LCD substrate using coolant having low surface tension and low viscosity properties in which a partial cut, cooling with coolant and then a full cut takes place after coolant is removedSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Jun 2, 2009·7 cites·5 claims
- 0472US6713720B2Method for cutting a non-metallic substrateSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Mar 30, 2004·16 cites·29 claims
- 0561US6770842B2Method and apparatus for cutting a substrate into multiple pieces with a single irradiation of a laser beamSAMSUNG ELECTRONICS CO LTD·Filed 2002·Granted Aug 3, 2004·7 cites·20 claims
- 0653US2004262273A1Method and apparatus for cutting a substrate into multiple pieces with a single irradiation of a laser beamFiled 2004·Application pending·0 cites
- 0741US2004056008A1Apparatus for cutting a non-metallic substrate using a laser beamFiled 2003·Application pending·0 cites
- 0839US2003052098A1Method and apparatus for cutting substrate using coolantFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →