Method and apparatus for cutting a substrate into multiple pieces with a single irradiation of a laser beam

Abstract

A method and apparatus for multiple-cutting a substrate into a plurality of pieces with a single irradiation of a laser beam are disclosed. At least two light reflectivity/transmittance control plates are placed on a path through which the light passes such that light reflectivity/transmittance is varied depending on an angle between the generated light and the plates. Plural surface portions of the substrate are heated simultaneously and are then cooled by a sprayed coolant so that the substrate is cut into a plurality of pieces simultaneously. Resultantly, a cutting time is substantially shortened and the productivity is enhanced.

1 - 8 . (Cancelled)  
     
     
         9 . A cutting device comprising: 
 means for generating a first incident light in a first direction;    means for splitting the first incident light into a plurality of lights and directing the plurality of lights toward a target object; and    means for moving the means for splitting in a second direction different form the first direction such that the plurality of lights are scanned along a plurality of predetermined paths on the target object.    
     
     
         10 . The cutting device of  claim 9 , wherein the second direction is perpendicular to the first direction.