Inventor · disambiguated record
Hyunjun Noh
Also filed as: NOH HYUNJUN
2 granted patents·2 pending applications·0 citations·filing 2020–2023
22Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0143US2024222324A1Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0241US11626380B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 11, 2023·0 cites·20 claims
- 0340US11824043B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 21, 2023·0 cites·18 claims
- 0432US2022037285A1Multi-chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →