Inventor · disambiguated record
Hyun Chul Seo
Also filed as: SEO HYUN · SEO HYUN CHUL
21 granted patents·13 pending applications·50 citations·filing 2001–2025
91Inventor score
Top patents by PatentIndex Score
34 records- 0191US11764128B2Semiconductor chip including through electrode, and semiconductor package including the sameSK HYNIX INC·Filed 2021·Granted Sep 19, 2023·2 cites·20 claims
- 0288US11398412B2Semiconductor packageSK HYNIX INC·Filed 2020·Granted Jul 26, 2022·2 cites·18 claims
- 0383US8399994B2Semiconductor chip and semiconductor package having the sameROH HEE RA·Filed 2011·Granted Mar 19, 2013·12 cites·36 claims
- 0480US12093349B2Method for distributing certificate of right to use digital content, and computer program stored in medium in order to carry out methodVICLIP INC·Filed 2021·Granted Sep 17, 2024·1 cites·9 claims
- 0579US7065084B2Data structure for implementation of traffic engineering function in multiprotocol label switching system and storage medium for storing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jun 20, 2006·31 cites·33 claims
- 0675US10366727B2Semiconductor chip module and semiconductor package including the sameSK HYNIX INC·Filed 2016·Granted Jul 30, 2019·2 cites·19 claims
- 0775US2025038119A1Semiconductor package including stacked semiconductor chipsSK HYNIX INC·Filed 2024·Application pending·0 cites
- 0872US12322681B2Semiconductor chip including through electrode, and semiconductor package including the sameSK HYNIX INC·Filed 2023·Granted Jun 3, 2025·0 cites·18 claims
- 0969US12278193B2Semiconductor devices including recognition marksSK HYNIX INC·Filed 2021·Granted Apr 15, 2025·0 cites·27 claims
- 1068US2025210539A1Semiconductor devices including recognition marksSK HYNIX INC·Filed 2025·Application pending·0 cites
- 1168US2024403390A1Method for distributing certificate of right to use digital content, and computer program stored in medium in order to carry out methodVICLIP INC·Filed 2024·Application pending·0 cites
- 1265US12142572B2Semiconductor package including stacked semiconductor chipsSK HYNIX INC·Filed 2022·Granted Nov 12, 2024·0 cites·20 claims
- 1361US11682614B2Semiconductor package and package substrate including vent holeSK HYNIX INC·Filed 2021·Granted Jun 20, 2023·0 cites·18 claims
- 1460US2025149484A1Semiconductor device including bumps and method of manufacturing the sameSK HYNIX INC·Filed 2024·Application pending·0 cites
- 1559US11823975B2Semiconductor packages including different type semiconductor chips having exposed top surfaces and methods of manufacturing the semiconductor packagesSK HYNIX INC·Filed 2021·Granted Nov 21, 2023·0 cites·19 claims
- 1658US2024170334A1Semiconductor chips, semiconductor packages, and manufacturing methods thereofSK HYNIX INC·Filed 2023·Application pending·0 cites
- 1755US11380595B2Semiconductor wafer, method for separating the semiconductor wafer, semiconductor chip, and semiconductor package including the semiconductor chipSK HYNIX INC·Filed 2020·Granted Jul 5, 2022·0 cites·17 claims
- 1853US11217544B2Semiconductor package including a semiconductor chip having a redistribution layerSK HYNIX INC·Filed 2020·Granted Jan 4, 2022·0 cites·23 claims
- 1953US10460771B2Semiconductor chip module and semiconductor package including the sameSK HYNIX INC·Filed 2019·Granted Oct 29, 2019·0 cites·21 claims
- 2052US11417618B2Semiconductor device including redistribution layer and method for fabricating the sameSK HYNIX INC·Filed 2020·Granted Aug 16, 2022·0 cites·23 claims
- 2152US2023154860A1Semiconductor chip including align mark protection pattern and semiconductor package including semiconductor chip including the align mark protection patternSK HYNIX INC·Filed 2022·Application pending·0 cites
- 2250US12394487B2Method of programming data in nonvolatile memory device and nonvolatile memory device performing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Aug 19, 2025·0 cites·20 claims
- 2350US11088117B2Semiconductor package including stacked semiconductor chipsSK HYNIX INC·Filed 2019·Granted Aug 10, 2021·0 cites·21 claims
- 2447US2022013469A1Semiconductor device and method for fabricating the sameSK HYNIX INC·Filed 2020·Application pending·0 cites
- 2545US12230328B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 2645US2024221826A1Flash memory and read recovery method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2745US2024242766A1Memory device and memory device operating methodSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2843US10991598B2Methods of fabricating semiconductor packages including circuit patternsSK HYNIX INC·Filed 2019·Granted Apr 27, 2021·0 cites·13 claims
- 2942US2014361437A1Package substrates and methods of fabricating the sameSK HYNIX INC·Filed 2013·Application pending·0 cites
- 3039US9666240B2Semiconductor device with decreased overlapping area between redistribution lines and signal linesSK HYNIX INC·Filed 2016·Granted May 30, 2017·0 cites·20 claims
- 3138US2010203934A1Method of providing game and system thereofSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 3236US2011086631A1Method for controlling portable device, display device, and video systemSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 3335US8772937B2Semiconductor device including inner interconnection structure able to conduct signals or voltages in the semiconductor chip with vertical connection vias and horizontal buried conductive linesSEO HYUN CHUL·Filed 2011·Granted Jul 8, 2014·0 cites·17 claims
- 3432US2012205672A1Semiconductor chip module and semiconductor pacakge having the sameSEO HYUN CHUL·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →