Inventor · disambiguated record
Hye Sook Shin
Also filed as: SHIN HYE SOOK
3 granted patents·7 pending applications·16 citations·filing 2009–2014
65Inventor score
Top patents by PatentIndex Score
10 records- 0182US8198543B2Rigid-flexible circuit board and method of manufacturing the sameKANG JUNG EUN·Filed 2009·Granted Jun 12, 2012·12 cites·17 claims
- 0263US8338714B2Heat-radiating substrate and manufacturing method thereofKANG JUNG EUN·Filed 2010·Granted Dec 25, 2012·2 cites·19 claims
- 0361US8242371B2Heat dissipating circuit board and method of manufacturing the sameSHIN HYE SOOK·Filed 2009·Granted Aug 14, 2012·2 cites·6 claims
- 0451US2014353004A1Insulation resin composition for printed circuit board having improved thermal conductivity and electrical properties, insulating film, prepreg and printed circuit boardSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 0550US2014187112A1Prepreg, method for manufacturing the same, and copper clad laminate using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0650US2011088928A1Heat dissipating substrateLIM CHANG HYUN·Filed 2009·Application pending·0 cites
- 0748US2014187674A1Resin composition with enhanced heat-releasing properties, heat-releasing film, insulating film, and prepregSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0848US2012273558A1Heat dissipating circuit board and method of manufacturing the sameSHIN HYE SOOK·Filed 2012·Application pending·0 cites
- 0939US2014174792A1Insulating film for printed circuit board having improved thermal conductivity, manufacturing method thereof, and printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1038US2013319734A1Package substrate and method of manufacturing the sameSHIN SANG HYUN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →