Heat dissipating circuit board and method of manufacturing the same

Abstract

Disclosed is a heat dissipating circuit board, which includes a metal core including an insulating layer formed on the surface thereof, a circuit layer formed on the insulating layer and including a seed layer and a first circuit pattern, and a heat dissipating frame layer bonded onto the circuit layer using solder and having a second circuit pattern, and in which the heat dissipating frame layer is bonded onto the circuit layer not by a plating process but by using solder, thus reducing the cost and time of the plating process and relieving stress applied to the heat dissipating circuit board due to the plating process. A method of manufacturing the heat dissipating circuit board is also provided.

1 . A method of manufacturing a heat dissipating circuit board, comprising:
 (A) forming an insulating layer on a surface of a metal core;   (B) forming a circuit layer including a seed layer and a first circuit pattern on the insulating layer;   (C) preparing a heat dissipating frame layer having a second circuit pattern; and   (D) bonding the heat dissipating frame layer onto the circuit layer using solder.   
     
     
         2 . The method as set forth in claim  7 , wherein, in (C), the heat dissipating frame layer has a thickness equal to or greater than tens of μm. 
     
     
         3 . The method as set forth in claim  7 , wherein (A) comprises:
 (A1) preparing a metal core comprising aluminum; and   (A2) anodizing the metal core thus forming an insulating layer comprising Al 2 O 3 .   
     
     
         4 . The method as set forth in claim  7 , wherein, in (C), the second circuit pattern is formed to be same as the first circuit pattern. 
     
     
         5 . The method as set forth in claim  7 , wherein, in (C), the second circuit pattern is formed to be different from the first circuit pattern.