Inventor · disambiguated record
Hyuk Woo
Also filed as: WOO HYUK · WOO HYUK JOON
25 granted patents·9 pending applications·16 citations·filing 2003–2025
91Inventor score
Files withHYUNDAI MOBIS CO LTD13HYUNDAI AUTRON CO LTD6MAGNACHIP SEMICONDUCTOR LTD4DIGIPARTS INC2DONGBU ELECTRONICS CO LTD2
Top patents by PatentIndex Score
34 records- 0184US9190469B2Super junction semiconductor device and method for manufacturing the sameMAGNACHIP SEMICONDUCTOR LTD·Filed 2014·Granted Nov 17, 2015·6 cites·14 claims
- 0279US12191386B2Power semiconductor device and method of fabricating the sameHYUNDAI MOBIS CO LTD·Filed 2024·Granted Jan 7, 2025·0 cites·15 claims
- 0375US9024381B2Semiconductor device and fabricating method thereofCHO MOON-SOO·Filed 2012·Granted May 5, 2015·5 cites·24 claims
- 0475US2024395928A1Power semiconductor device and method of fabricating the sameHYUNDAI MOBIS CO LTD·Filed 2024·Application pending·0 cites
- 0570US7642117B2CMOS image sensorDONGBU HITEK CO LTD·Filed 2006·Granted Jan 5, 2010·2 cites·13 claims
- 0665US11961903B2Power semiconductor device and method of fabricating the sameHYUNDAI MOBIS CO LTD·Filed 2021·Granted Apr 16, 2024·0 cites·15 claims
- 0765US9496335B2Super junction semiconductor device and method for manufacturing the sameMAGNACHIP SEMICONDUCTOR LTD·Filed 2015·Granted Nov 15, 2016·1 cites·7 claims
- 0863US12484271B2Power semiconductor device and method for fabricating the sameHYUNDAI MOBIS CO LTD·Filed 2022·Granted Nov 25, 2025·0 cites·17 claims
- 0963US9472614B2Super junction semiconductor deviceMAGNACHIP SEMICONDUCTOR LTD·Filed 2014·Granted Oct 18, 2016·2 cites·24 claims
- 1056US12513927B2Power semiconductor device, power semiconductor chip including the same, and method for manufacturing the sameHYUNDAI MOBIS CO LTD·Filed 2022·Granted Dec 30, 2025·0 cites·15 claims
- 1156US12402339B2Power semiconductor device, power semiconductor chip including the same, and method for manufacturing the sameHYUNDAI MOBIS CO LTD·Filed 2022·Granted Aug 26, 2025·0 cites·16 claims
- 1254US12107120B2Power semiconductor deviceHYUNDAI MOBIS CO LTD·Filed 2021·Granted Oct 1, 2024·0 cites·13 claims
- 1352US2023012361A1Power semiconductor deviceHYUNDAI MOBIS CO LTD·Filed 2022·Application pending·0 cites
- 1451US12068412B2Power semiconductor deviceHYUNDAI MOBIS CO LTD·Filed 2021·Granted Aug 20, 2024·0 cites·20 claims
- 1551US7682863B2CMOS image sensor and method for fabricating the sameDONGBU HITEK CO LTD·Filed 2007·Granted Mar 23, 2010·0 cites·11 claims
- 1649US2025261403A1Power semiconductor device including gate structure with improved reliabilityHYUNDAI MOBIS CO LTD·Filed 2025·Application pending·0 cites
- 1749US2025294803A1Power semiconductor deviceHYUNDAI MOBIS CO LTD·Filed 2025·Application pending·0 cites
- 1849US2025261429A1Power semiconductor device including gate with improved reliabilityHYUNDAI MOBIS CO LTD·Filed 2025·Application pending·0 cites
- 1948US11830914B2Power semiconductor device and method of fabricating the sameHYUNDAI MOBIS CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·20 claims
- 2047US11164964B2Power semiconductor device and method of fabricating the sameHYUNDAI AUTRON CO LTD·Filed 2018·Granted Nov 2, 2021·0 cites·8 claims
- 2146US10181519B2Power semiconductor deviceHYUNDAI AUTRON CO LTD·Filed 2017·Granted Jan 15, 2019·0 cites·15 claims
- 2245US10886377B2Power semiconductor device and manufacturing method thereofHYUNDAI AUTRON CO LTD·Filed 2019·Granted Jan 5, 2021·0 cites·9 claims
- 2345US2022333937A1Method for providing integratednavigation service using vehicle sharing network, and device and system for sameHUMAX CO LTD·Filed 2020·Application pending·0 cites
- 2443US2004106400A1System for monitoring mobile communication performanceWILLTEK CORP·Filed 2003·Application pending·0 cites
- 2542US9905681B2Power semiconductor device and method of fabricating the sameHYUNDAI AUTRON CO LTD·Filed 2017·Granted Feb 27, 2018·0 cites·16 claims
- 2642US2007045571A1Method for arranging semiconductor wafer to ion-beam in disk-type implantationDONGBU ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 2741US10115794B2Semiconductor device comprising accumulation layer channel and inversion layer channelHYUNDAI MOTOR CO LTD·Filed 2016·Granted Oct 30, 2018·0 cites·8 claims
- 2841US10096687B2Semiconductor device and method of fabricating the sameHYUNDAI AUTRON CO LTD·Filed 2017·Granted Oct 9, 2018·0 cites·9 claims
- 2941US9865677B2Super junction semiconductor deviceMAGNACHIP SEMICONDUCTOR LTD·Filed 2015·Granted Jan 9, 2018·0 cites·23 claims
- 3041US7470596B2Capacitors having a horizontally folded dielectric layer and methods for manufacturing the sameDONGBU ELECTRONICS CO LTD·Filed 2005·Granted Dec 30, 2008·0 cites·5 claims
- 3140US7176101B2Method of forming isolation oxide layer in semiconductor integrated circuit deviceDONGBU ELECTRONICS·Filed 2005·Granted Feb 13, 2007·0 cites·7 claims
- 3238US10121850B2Power semiconductor device and method of fabricating the sameHYUNDAI AUTRON CO LTD·Filed 2017·Granted Nov 6, 2018·0 cites·9 claims
- 3327US2022277279A1Method, device, and system for providing vehicle sharing serviceDIGIPARTS INC·Filed 2020·Application pending·0 cites
- 3425US11388005B2Connected gateway server system for real-time vehicle control serviceDIGIPARTS INC·Filed 2017·Granted Jul 12, 2022·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →